IP Library Patent Application 13254155
Patent Application
App. No. 13/254,155

Method and Apparatus for Machining Thin-Film Layer of Workpiece

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Quick Facts
Patent No.
US None
App. No.
13/254,155
Abstract

An apparatus for machining a thin-film layer of a workpiece, which is a transparent glass on which a thin-film layer is disposed on a top surface thereof, includes a workpiece-underside support mechanism for supporting the workpiece in a vertical direction by an air floatation mechanism and a suction mechanism, a clamp device for gripping the workpiece so as to follow the movement in the vertical direction of the workpiece, and a machining head for machining the thin-film layer with a laser beam. The machining head machines the thin-film layer on the top surface of the workpiece by irradiating the workpiece with a laser beam entering through the underside of the workpiece. Further including nozzles, the thin-film layer is machined while the cooling medium is delivered from the nozzles disposed by the thin-film layer side.

Claims (14)

1 . (canceled)

2 . (canceled)

3 . (canceled)

4 . (canceled)

5 . An apparatus for machining a thin-film layer of a workpiece, which is a transparent glass on which a thin-film layer is disposed on a top surface thereof, comprising:

a support device for supporting the workpiece in a vertical direction by an air floatation mechanism and a suction mechanism,

a clamp device for gripping the workpiece so as to follow the movement in the vertical direction of the workpiece, and

a laser irradiating device for machining the thin-film layer by a laser beam, wherein

the laser irradiating device machines the thin-film layer on the top surface side by irradiating the workpiece with a laser beam entering through the underside of the workpiece.

6 . (canceled)

7 . The apparatus for machining a thin-film layer of a workpiece according to claim 5 , further comprising a nozzle for delivering a cooling medium, wherein

during machining, the cooling medium is delivered from the nozzle disposed by the thin-film layer side to a position at which the laser beam emitted from the laser irradiating device is incident on the thin-film layer.

8 . The apparatus for machining a thin-film layer of a workpiece according to claim 7 ,

wherein the cooling medium is one of a sprayed liquid, a liquid, and a gas.

Assignments (2)
CHANGE OF NAME Recorded Apr 3, 2014
From: HITACHI VIA MECHANICS, LTD.
To: VIA MECHANICS, LTD.
Reel/Frame 032600/0580 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 27, 2011
From: ARAI, KUNIO; KANAYA, YASUHIKO; ISHII, KAZUHISA; HONDA, HIROSHI
To: HITACHI VIA MECHANICS, LTD.
Reel/Frame 027130/0630 →