Assignment of Assignor's Interest

Recorded: 2011-10-27 Pages: 4

Assignors

ARAI, KUNIO

Executed: 2011-09-17

KANAYA, YASUHIKO

Executed: 2011-09-24

ISHII, KAZUHISA

Executed: 2011-08-17

HONDA, HIROSHI

Executed: 2011-08-17

Assignee

HITACHI VIA MECHANICS, LTD.

2100, KAMIIMAIZUMI, EBINA-SHI, KANAGAWA, 243-0488, JAPAN

Covered Property (1)

Method and Apparatus for Machining Thin-Film Layer of Workpiece

Application: 13/254,155 →

Publication: US 2012/0031147

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.