Laser machining method and laser machining apparatus
View Patent ↗There is provided a laser machining method and a laser machining apparatus whose machining accuracy and quality excel without lowering machining efficiency. One hole is machined by a split beam that is a first pulsed laser beam and another split beam that is a second pulsed laser beam whose irradiation position is determined based on irradiation position of the first laser beam. In this case, the machining quality may be improved by machining the circular hole by equalizing circling directions and angular velocity of the split beams. A beam splitter splits a laser beam outputted out of one laser oscillator into the split beams and AOMs can time-share them.
1. A laser machining method of trepanning a hole in a workpiece using a first pulsed laser beam with an irradiation position positioned by a first XY galvanic unit, and by using a second pulsed laser beam with an irradiation position positioned by the first XY galvanic unit and a second XY galvanic unit, each of the first XY galvanic unit and the second XY galvanic unit having a galvanic mirror, the hole having a diameter larger than a diameter of the first pulsed laser and the second pulsed laser, said method comprising:
adjusting the first XY galvanic unit so that the first pulsed laser beam draws a first circular orbit having a first radius;
adjusting the second XY galvanic unit so that the second pulsed laser beam draws a second circular orbit having a second radius, the second circular orbit being centered on the irradiation position of the first pulsed laser beam; and
irradiating the first pulsed laser beam and the second pulsed laser beam toward the workpiece at predetermined time intervals on the first circular orbit and the second circular orbit, respectively, while always rocking the galvanic mirror of each of the first XY galvanic unit and the second XY galvanic unit so as to position the irradiation position of the first pulsed laser beam using the first XY galvanic unit and so as to position the irradiation position of the second pulsed laser beam using the first XY galvanic unit and the second XY galvanic unit to thereby trepan the hole in the workpiece.
2. The laser machining method of claim 1 , further comprising moving the first pulsed laser beam and the second pulsed laser beam in the same direction on respective orbits and with the same angular velocity.
3. The laser machining method of claim 1 , further comprising moving the second pulsed laser beam along the second circular orbit located inside the first circular orbit while moving the first pulsed laser beam along the first circular orbit.
4. The laser machining method of claim 1 , wherein said irradiating of the first pulsed laser beam and said irradiating of the second pulsed laser beam comprise irradiating such that each of the first pulsed laser beam and the second pulsed laser beam have varying values of energy intensity.
5. The laser machining method of claim 1 , further comprising forming the first pulsed laser beam and the second pulsed laser beam as time-shared laser beams outputted from the same single laser oscillator.
6. The laser machining method of claim 1 , further comprising outputting a single pulse laser beam from a laser oscillator such that the single pulse laser beam is applied to at least one of a beam splitter and a half-mirror, and forming split beams from the single pulse laser beam using the at least one of the beam splitter and the half-mirror, the split beams comprising the first pulsed laser beam and the second pulsed laser beam.
7. The laser machining method of claim 1 , wherein the first pulsed laser beam is irradiated to first positions on the workpiece and the second pulsed laser beam is irradiated to second positions on the workpiece, each of the second positions being located a predetermined distance from a respective one of the first positions, the predetermined distance being determined prior to determining any of the first positions of the first pulsed laser beam.
8. The laser machining method of claim 7 , wherein said laser machining method comprises only irradiating the first pulsed laser beam and the second pulsed laser beam, and said irradiating is performed such that all of the second positions are spaced apart a predetermined distance from the first positions.