IP Library Granted Patent US 7,777,898
Granted Patent B2
US 7,777,898 · App. 12/071,356 · Granted Aug 17, 2010

Workpiece machining apparatus

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Quick Facts
Patent No.
US 7,777,898
App. No.
12/071,356
Granted
Aug 17, 2010
Kind
B2
Abstract

A laser machining apparatus is capable of improving workpiece machining precision. The laser machining apparatus has a movable table for supporting a workpiece to be machined, and a camera for detecting the position of the workpiece by reflection light from an alignment mark formed through the workpiece. The apparatus also includes a jig plate provided between the table and the workpiece, and has light-receiving holes that overlap with the alignment mark (through-hole) and that are larger than the alignment mark (through hole).

Claims (10)

1. A workpiece machining apparatus, comprising:

a movable table for supporting a workpiece to be machined;

a position detecting device for detecting a position of the workpiece by reflected light from a position-detecting through hole formed through the workpiece, the position detecting device including a camera surrounded by illuminants for illuminating the position-detecting through hole of the workpiece, the camera facing an upper surface of the workpiece to be machined; and

a plate-like intermediate member provided between an upper surface of the movable table and a lower surface of the workpiece, the intermediate member having a light-receiving opening overlapping with the position-detecting through hole of the workpiece and whose opening area is wider than an opening area of the position-detecting through hole.

2. The workpiece machining apparatus according to claim 1 , wherein a horizontal cross section of the light receiving opening of the intermediate member is circular.

3. The workpiece machining apparatus according to claim 1 , wherein the light-receiving opening of the intermediate member has a diameter larger than a diameter of the position-detecting through hole of the workpiece.

4. The workpiece machining apparatus according to claim 3 , wherein a thickness of the intermediate member is larger than the diameter of the light-receiving opening of the intermediate member.

5. The workpiece machining apparatus according to claim 2 , wherein the light-receiving opening of the intermediate member has a diameter larger than a diameter of the position-detecting through hole of the workpiece.

6. The workpiece machining apparatus according to claim 1 , wherein the movable table has vacuum chuck holes, and the intermediate member has vacuum chuck holes aligned with the vacuum chuck holes of the movable table so as to allow a vacuum to be applied to the workpiece to thereby retain the workpiece against the intermediate member.

7. The workpiece machining apparatus according to claim 1 , further comprising a laser oscillator and mirrors for directing a laser beam generated by the laser oscillator toward the workpiece.

Assignments (2)
CHANGE OF NAME Recorded Apr 3, 2014
From: HITACHI VIA MECHANICS, LTD.
To: VIA MECHANICS, LTD.
Reel/Frame 032600/0580 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2008
From: MATSUMURA, KAORU; KIMURA, FUMIAKI
To: HITACHI VIA MECHANICS, LTD.
Reel/Frame 020768/0509 →