Drilling method and laser machining apparatus
View Patent ↗A drilling method and a laser machining apparatus which can shorten the measuring time of workpiece surface height and improve the machining efficiency in spite of irregularities of about 10-30 μm high in the surface of a table. Surface heights of the table is measured at lattice points in advance. Top surface height at a desired point of the workpiece mounted on the table is measured. Surface height of the point is arithmetically obtained using heights of four points surrounding the point. The difference between the measured height and the arithmetically obtained height is set as the plate thickness of the workpiece. Top surface height of the workpiece at a machining position is regarded as the sum of the plate thickness and the height at that position obtained from the table surface heights.
1. A drilling method comprising the steps of:
measuring heights of a surface of a table on which a workpiece is to be mounted, from a predetermined reference surface, at lattice points before mounting the workpiece thereon, and storing the measured heights of the surface of the table at the lattice points;
measuring height at a desired point of a top surface of the workpiece, mounted on the table and having a uniform plate thickness, before machining;
obtaining the height of the surface of the table at the desired point by an arithmetic operation using the heights of the surface of the table at four lattice points of a minimum unit surrounding the desired point;
setting the difference between the measured height of the top surface of the workpiece at the point, and the height of the surface of the table obtained by the arithmetic operation, as the plate thickness of the workpiece;
setting the height of the top surface of the workpiece at another machining position as the heights with the plate thickness added to the heights of the surface of the table at the machining position obtained by the arithmetic operation using the heights of the surface of the table at four minimum lattice points surrounding the other machining position; and
drilling the other machining position.
2. A laser machining apparatus for machining a workpiece with a laser beam, comprising:
a converging lens for condensing the laser beam, the converging lens being positioned by a positioning apparatus at a height so as to set an image position of the laser beam at a predetermined distance from a surface of the workpiece;
a measurement unit for measuring heights of a surface of a table on which the workpiece is to be mounted from a predetermined reference surface, at lattice points before mounting the workpiece thereon, and measuring the measured heights of the surface of the table at the lattice points and the height at an arbitrary point of the top surface of the workpiece mounted on the table and having a uniform plate thickness from the reference surface;
a storage unit for storing the heights of the surface of the table at the lattice points measured by the measurement unit; and
an arithmetic unit for obtaining a height of the surface of the table corresponding to the arbitrary point by an arithmetic operation using the height of the surface of the table at four lattice points of a minimum unit surrounding the arbitrary point, stored in the storage unit; wherein the positioning apparatus is configured in such a manner that:
a difference between the height of the top surface of the workpiece at the arbitrary point and the height of the surface of the table obtained, by the arithmetic unit, corresponding to the desired point, and is set as the plate thickness of the workpiece;
a value with the plate thickness added to the height of the table at the other machining position obtained by the arithmetic unit based on the height of the table at the lattice points stored in the storage unit is set as the height of the top surface of the workpiece at another machining position; and
the converging lens is positioned at a height with respect to the top surface of the workpiece at the other machining position.