IP Library Granted Patent US 7,249,485
Granted Patent B2
US 7,249,485 · App. 10/935,218 · Granted Jul 31, 2007

Substrate processing apparatus

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,249,485
App. No.
10/935,218
Granted
Jul 31, 2007
Kind
B2
Abstract

Substrate processing apparatus for processing holes accurately positioned in an long film, comprising: work supporting devices for supporting the work; clamping devices for clamping the work onto the work supporting devices; first movement devices for moving the work supporting devices in the transferring direction of the work; guiding devices for guiding the work supporting devices; guide supporting devices for supporting these guiding devices; and second movement devices for moving the guide supporting devices in the direction perpendicular to the transferring direction of the work, wherein two pins or holes are disposed on or in each of the guiding devices, holes or pins to engage with the pins or holes are disposed on or in each of the guide supporting devices to combine the guiding devices and guide supporting devices in a grid form, and the holes and pins at four junctions are fitted.

Claims (9)

1. A substrate processing apparatus for processing a sheet-shaped work while transferring it, comprising:

work supporting means for supporting said work in a vertical direction;

clamping means for clamping said work onto said work supporting means;

first movement means for moving said work supporting means in the transferring direction of said work;

guiding means for guiding said work supporting means;

guide supporting means for supporting these guiding means; and

second movement means for moving said guide supporting means in a direction perpendicular to the transferring direction of said work,

wherein two pins or holes are disposed on or in each of said guiding means, holes or pins to engage with said pins or holes are disposed on or in each of said guide supporting means to combine said guiding means and guide supporting means in a grid form, and the holes and pins at four junctions are fitted with substantially no gaps between them.

2. A substrate processing apparatus, as claimed in claim 1 , wherein the fitting of said hole and said pin at one of said four junctions is made with substantially no gap between them, and the fitting at the other three junctions is allowed larger gaps.

Assignments (2)
CHANGE OF NAME Recorded Apr 3, 2014
From: HITACHI VIA MECHANICS, LTD.
To: VIA MECHANICS, LTD.
Reel/Frame 032600/0580 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 8, 2004
From: HONDA, YUJI; NAGASAWA, KATSUHIRO
To: HITACHI VIA MECHANICS, LTD.
Reel/Frame 015777/0190 →