IP Library Granted Patent US 7,897,893
Granted Patent B2
US 7,897,893 · App. 11/117,414 · Granted Mar 1, 2011

Method for drilling holes in a substrate, in particular an electrical circuit substrate, by means of a laser beam

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,897,893
App. No.
11/117,414
Granted
Mar 1, 2011
Kind
B2
Abstract

Disclosed is a valve having a housing with a valve seat for a two-piece flap which is rotatably mounted on a drive shaft. An annular piston seal and an adjacent cover disk are disposed between the first part and the second part of the two-piece flap so as to revolve therearound. The diameter of the cover disk is smaller than the diameter of the annular piston seal which is embodied as a metal ring that is provided with a gap. The invention also relates to the use of the valve as a gas recirculation valve.

Claims (14)

1. A method for laser drilling holes in a substrate, comprising:

providing a laser beam having a beam spot diameter which is smaller than a diameter of a hole to be drilled;

aligning the laser beam to a new hole;

directing a beam axis in a jump direction predefined by a starting position to a center of the hole to be drilled; and

directing the beam axis, with continuous movement, in a defined radial traversing movement away from the center and onto a defined circular path, wherein

an angular direction of the traversing movement is defined as a function of the jump direction such that any change in direction of the beam axis at the center is less than or equal to a predefined maximum angle or else the direction is maintained, and wherein

a number of fixed angular directions for the traversing movement is specified according to the predefined maximum angular range and wherein one of these angular directions is selected depending on the jump direction, and wherein

the maximum angular range being 360°/2n, where n is an integer greater than 2, and wherein

the laser is activated when the circular path is reached.

2. The method according to claim 1 ,

wherein eight angular ranges of 45°each are predefined and eight thereto corresponding angular directions for the traversing movement are predefined using an appropriate drilling program.

3. The method according to claim 1 ,

wherein a number and sequence of holes to be drilled on a substrate are pre-programmed and wherein a drilling program with corresponding traversing direction predefined for each hole according to the jump directions occurring.

4. The method according to claim 1 , wherein the fixing angular directions are so linked that the predefined maximum angular change at the center is 22.5° between the jump direction and the selected angular direction.

Assignments (3)
CHANGE OF NAME Recorded Apr 3, 2014
From: HITACHI VIA MECHANICS, LTD.
To: VIA MECHANICS, LTD.
Reel/Frame 032600/0580 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 18, 2006
From: SIEMENS AKTIENGESELLSCHAFT
To: HITACHI VIA MECHANICS, LTD.
Reel/Frame 017201/0756 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 18, 2005
From: KILTHAU, ALEXANDER; MAYER, HANS JURGEN; VAN BIESEN, MARC
To: SIEMENS AKTIENGESELLSCHAFT
Reel/Frame 016787/0275 →