IP Library › Assignment 016787/0275
Patent Assignment
Reel/Frame 016787/0275

Assignment of Assignor's Interest

Recorded: 2005-07-18 Pages: 4
Assignors
KILTHAU, ALEXANDER
Executed: 2005-05-04
MAYER, HANS JURGEN
Executed: 2005-05-02
VAN BIESEN, MARC
Executed: 2005-07-04
Assignee
SIEMENS AKTIENGESELLSCHAFT
WITTELSBACHERPLATZ 2, MUNICH, D-80333, GERMANY
Covered Property (1)
Method for Drilling Holes in a Substrate, in Particular an Electrical Circuit Substrate, by Means of a Laser Beam
Patent: 7,897,893 →
Application: 11/117,414 →
Publication: US 2007/0187373
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 18, 2006
From: SIEMENS AKTIENGESELLSCHAFT
To: HITACHI VIA MECHANICS, LTD.
Reel/Frame 017201/0756 →
Change of Name Apr 3, 2014
From: HITACHI VIA MECHANICS, LTD.
To: VIA MECHANICS, LTD.
Reel/Frame 032600/0580 →