IP Library Assignment 017198/0048
Patent Assignment
Reel/Frame 017198/0048

Assignment of Assignor's Interest

Recorded: 2006-01-13 Pages: 4
Assignor
SIEMENS AKTIENGESELLSCHAFT
Executed: 2005-08-16
Assignee
HITACHI VIA MECHANICS, LTD.
2100 KAMIIMAIZUMI, EBINA-SHI KANGAWA, 243-0488, JAPAN
Covered Properties (19)
Method for Working Members Composed of Oxide Material
Patent: 4,900,892 →
Application: 07/199,526 →
Device and Method for Processing Substrates
Patent: 6,437,283 →
Application: 09/725,348 →
Publication: US 2002/0063113
Method and Device for Calibrating a Workpiece Laser-Processing Machine
Patent: 6,615,099 →
Application: 09/743,585 →
Device for the Laser Processing of Flat Workpieces
Patent: 6,423,929 →
Application: 09/743,890 →
Method for Introducing Plated-Through Holes into an Electrically Insulating Base Material Having a Metal Layer on Each Side
Patent: 6,696,665 →
Application: 09/954,410 →
Publication: US 2002/0027129
Method for Describing a Predetermined Desired Course with a Beam Consisting of Particles or Waves and Use of This Method
Patent: 6,639,180 →
Application: 10/018,381 →
Method of Laser Drilling
Patent: 6,649,864 →
Application: 10/076,301 →
Publication: US 2003/0047544
Method for Drilling Micro-Holes with a Laser Beam
Patent: 6,610,960 →
Application: 10/079,895 →
Publication: US 2002/0190037
Method and Apparatus for Structuring Printed Circuit Boards
Patent: 6,783,688 →
Application: 10/079,896 →
Publication: US 2003/0000916
Method and Device for Laser Drilling Laminates
Patent: 6,713,719 →
Application: 10/089,301 →
Method and Device for Laser Drilling Organic Materials
Patent: 6,861,008 →
Application: 10/089,308 →
Method of Calibrating the Optical System of a Laser Machine for Processing Electrical Circuit Substrates
Patent: 6,678,061 →
Application: 10/121,731 →
Publication: US 2003/0002055
Laser Machining Device
Patent: 6,727,462 →
Application: 10/345,164 →
Publication: US 2003/0141288
Method for Drilling Holes in a Substrate
Patent: 6,781,092 →
Application: 10/369,623 →
Publication: US 2003/0201260
Method for Producing a Trench Structure in a Polymer Substrate
Patent: 6,822,191 →
Application: 10/378,600 →
Publication: US 2003/0201258
Method and Apparatus for Laser Processing
Patent: 6,833,528 →
Application: 10/378,884 →
Publication: US 2003/0168435
Arrangement and Method for Processing Electrical Substrates Using Lasers
Patent: 6,849,823 →
Application: 10/663,916 →
Publication: US 2004/0164057
Method and system to drill holes in an electric circuit substrate
Application: 10/673,206 →
Publication: US 2004/0206733
Operating Method for a Laser Machining System
Patent: 7,005,604 →
Application: 10/933,250 →
Publication: US 2005/0035098
Related Assignments (23)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest. Jul 18, 1988
From: BAEUERLE, DIETER; EYETT, MICHAEL; THOMANN, HELMUT; WERSING, WOLFRAM
To: SIEMENS AKTIENGESELLSCHAFT, A CORP. OF GERMANY
Reel/Frame 004940/0703 →
Assignment of Assignor's Interest Jan 11, 2001
From: MULLER, LOTHAR; POLGAR, MLADEN; DE STEUR, HUBERT; VAN BIESEN, MARK
To: SIEMENS AKTIENGESELLSCHAFT
Reel/Frame 011519/0943 →
Assignment of Assignor's Interest Jan 16, 2001
From: MULLER, LOTHAR; METZ, DANIEL; DIETRICH, STEFAN
To: SIEMENS AKTIENGESELLSCHAFT
Reel/Frame 011576/0090 →
Assignment of Assignor's Interest Mar 29, 2002
From: DE STEUR, HUBERT; HEERMAN, MARCEL; PUYMBROECK, JOZEF VAN
To: SIEMENS AKTIENGESELLSCHAFT
Reel/Frame 012988/0332 →
Assignment of Assignor's Interest Mar 29, 2002
From: DE STEUR, HUBERT; HEERMAN, MARCEL; VAN PUYMBROECK, JOZEF
To: SIEMENS AKTIENGESELLSCHAFT
Reel/Frame 012988/0522 →
Assignment of Assignor's Interest Apr 29, 2002
From: DE STEUR, HUBERT; HEERMAN, MARCEL
To: SIEMENS AKTIENGESELLSCHAFT
Reel/Frame 012905/0120 →
Assignment of Assignor's Interest May 8, 2002
From: DE STEUR, HUBERT; PAN, WEI; ROELANTS, EDDY; MAYER, HANS JUERGEN
To: SIEMENS AKTIENGESELLSCHAFT
Reel/Frame 013171/0832 →
Assignment of Assignor's Interest May 13, 2002
From: DE STEUR, HUBERT; EDME, SEBASTIAN; HEERMAN, MARCEL; ROELANTS, EDDY
To: SIEMENS AKTIENGESELLSCHAFT
Reel/Frame 012887/0315 →
Assignment of Assignor's Interest May 20, 2002
From: DE STEUR, HUBERT; HEERMAN, MARCEL; ROELANTS, EDDY
To: SIEMENS AKTIENGESELLSCHAFT
Reel/Frame 012913/0274 →
Assignment of Assignor's Interest May 30, 2002
From: KILTHAU, ALEXANDER; KLETTI, ANDRE; MAYER, HANS JUERGEN; ROELANTS, EDDY
To: SIEMENS AKTIENGESELLSCHAFT
Reel/Frame 012945/0075 →
Assignment of Assignor's Interest Jun 19, 2002
From: WIGGERMANN, UDO; SCHREINER, ALEX; MAYER,HANS JURGEN; HIGGINS, LEO
To: SIEMENS AKTIENGESELLSCHAFT
Reel/Frame 013017/0019 →
Assignment of Assignor's Interest Jan 16, 2003
From: MAYER, HANS JUERGEN
To: SIEMENS AKTIENGESELLSCHAFT
Reel/Frame 013672/0404 →
Assignment of Assignor's Interest Mar 5, 2003
From: DE STEUR, HUBERT; ROELANTS, EDDY
To: SIEMENS AKTIENGESELLSCHAFT
Reel/Frame 013849/0396 →
Assignment of Assignor's Interest Jun 30, 2003
From: DE STEUR, HUBERT; KILTHAU, ALEXANDER; KLETTI, ANDRE; MAYER, HANS JUERGEN
To: SIEMENS AKTIENGESELLSCHAFT
Reel/Frame 014221/0282 →
Assignment of Assignor's Interest Jul 1, 2003
From: DE STEUR, HUBERT; LESJAK, STEFAN; PAN, WEI
To: SIEMENS AKTIENGESELLSCHAFT
Reel/Frame 014226/0428 →
Assignment of Assignor's Interest Dec 29, 2003
From: HEERMAN, MARCEL
To: SIEMENS AKTIENGESELLSCHAFT
Reel/Frame 014837/0628 →
Assignment of Assignor's Interest Feb 11, 2004
From: EDME, SEBASTIEN; LESJAK, STEFAN; ROELANTS, EDDY
To: SIEMENS AKTIENGESELLSCHAFT
Reel/Frame 014974/0605 →
Assignment of Assignor's Interest Feb 17, 2004
From: HILLEBRAND, DIRK; MAYER, HANS JUERGEN; METZ, DANIEL; SCHUCHART, JOHANNES
To: SIEMENS AKTIENGESELLSCHAFT
Reel/Frame 014979/0808 →
Assignment of Assignor's Interest Sep 3, 2004
From: DIETRICH, STEFAN; SCHUCHART, JOHANNES
To: SIEMENS AKTIENGESELLSCHAFT
Reel/Frame 015802/0528 →
Assignment of Assignor's Interest Oct 28, 2005
From: SIEMENS AKTIENGESELLSCHAFT
To: HITACHI VIA MECHANICS, LTD.
Reel/Frame 017152/0394 →
Assignment of Assignor's Interest Nov 3, 2005
From: ZINKE, THOMAS; KLINGER, KATHARINA
To: HITACHI VIA MECHANICS, LTD.
Reel/Frame 017173/0761 →
Assignment of Assignor's Interest Mar 13, 2006
From: SIEMENS AKTIENGESELLSCHAFT
To: HITACHI VIA MECHANICS, LTD.
Reel/Frame 017666/0270 →
Change of Name Apr 3, 2014
From: HITACHI VIA MECHANICS, LTD.
To: VIA MECHANICS, LTD.
Reel/Frame 032600/0580 →