Patent Assignment
Reel/Frame 014837/0628
Assignment of Assignor's Interest
Recorded: 2003-12-29
Pages: 2
Assignor
HEERMAN, MARCEL
Executed: 2001-09-28
Assignee
SIEMENS AKTIENGESELLSCHAFT
POSTFACH 22 16 34, ZT GG VM, MUNCHEN, 80506, GERMANY
Covered Property
(1)
Method for Introducing Plated-Through Holes into an Electrically Insulating Base Material Having a Metal Layer on Each Side
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.