IP Library Granted Patent US 7,005,604
Granted Patent B2
US 7,005,604 · App. 10/933,250 · Granted Feb 28, 2006

Operating method for a laser machining system

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Quick Facts
Patent No.
US 7,005,604
App. No.
10/933,250
Granted
Feb 28, 2006
Kind
B2
Abstract

The invention relates to an operating method and a trolley for a system used for machining objects by using laser beams, particularly for a system used for boring or structuring substrates. The system has a great number of slow-working laser machining machines than rapid working laser machining machines. A rapid-working laser machining machine utilized afterwards or beforehand can be better used to capacity due to the parallel operation of a number of slow-working laser machining machines. The transfer of objects to be machined or already machined objects is preferably effected by means of trolleys, which are both compatible with both the loading stations and the unloading stations of the laser machining machines. This enables the objects, which are to be machined, to be directly received by a trolley located in a loading station and, after machining, to be placed in a trolley that is introduced into an unloading station of a laser machining machine.

Claims (19)

1. A method of machining objects using laser beams, the method applicable to a system for boring or structuring multilayer printed circuit boards and/or electronic components, the system having at least two slow-working laser machining machines and at least one rapid-working laser machining machine, the method comprising the steps of:

machining a first number of objects using a first slow-working laser machining machine,

machining a second number of objects using a second slow-working laser machining machine, and

machining a further number of objects with a rapid-working laser machining machine, the further number being larger than the first and second numbers,

whereby operating sequences of the laser machining machines are coordinated such that:

after machining with the first or second slow-working laser machining machine, the first and second number of objects are supplied in an alternating manner to the rapid-working laser machining machine for further machining, or

the further number of objects are divided into at least a first and a second subsets after machining, using the rapid-working laser machining machine, whereby the first subset is supplied to the first slow-working laser machining machine and the second subset is supplied to the second slow-working laser machining machine for further machining.

2. The method according to claim 1 , wherein objects are supplied via a transport system.

3. The method according to claim 2 , wherein:

objects to be machined are collected from a loading station assigned to a respective laser machining machine and already machined objects are deposited at an unloading station assigned to the respective laser machining machine, and

at about a same time, a plurality of objects are supplied to the loading station and a plurality of objects are removed from the unloading station using the transport system.

4. The method according to claim 3 , wherein at least two trolleys are used as the transport system, such that:

a first trolley is coupleable to a loading station of an upstream laser machining machine,

a second trolley is coupleable to an unloading station of the upstream laser machining machine, and

the second trolley is further coupleable to a loading station of a downstream laser machining machine connected downstream to the upstream laser machining machine such that objects to be machined are machined after being machined using the downstream laser machining machine.

5. The method according to claim 1 , wherein lasers of the slow working laser machining machine operate in a mean or remote infrared spectral range.

6. The method according to claim 1 , wherein lasers of the rapid-working laser machining machine operate in a visible or ultraviolet spectral range.

7. The method according to claim 5 , further comprising the steps of machining multilayer objects whereby dielectric layers are removed using the slow-working laser machining machines and metal intermediate layers are removed using the rapid-working laser machining machine.

8. The method according to claim 1 , further comprising the step of boring holes into objects to be machined.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 13, 2006
From: SIEMENS AKTIENGESELLSCHAFT
To: HITACHI VIA MECHANICS, LTD.
Reel/Frame 017666/0270 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 13, 2006
From: SIEMENS AKTIENGESELLSCHAFT
To: HITACHI VIA MECHANICS, LTD.
Reel/Frame 017198/0048 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 3, 2005
From: ZINKE, THOMAS; KLINGER, KATHARINA
To: HITACHI VIA MECHANICS, LTD.
Reel/Frame 017173/0761 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 3, 2004
From: DIETRICH, STEFAN; SCHUCHART, JOHANNES
To: SIEMENS AKTIENGESELLSCHAFT
Reel/Frame 015802/0528 →