Method and device for laser drilling organic materials
View Patent ↗For the laser drilling of organic materials, in particular for making blind holes in dielectric layers, a frequency-doubled Nd-vanadate laser with the following parameters is used: pulse width <40 ns pulse frequency ≧20 kHz wavelength =532 nm.
1. A method for laser drilling of organic materials, comprising:
using a frequency-doubled Nd-vanadate laser for the laser drilling, wherein the laser includes the following laser parameters,
pulse width
<40
ns,
pulse frequency
≧20
kHz, and
wavelength
=532
nm.
2. The method as claimed in claim 1 , wherein a laser pulse width of <30 ns is used.
3. The method as claimed in claim 1 , wherein a focused laser beam with a spot diameter of between 10 μm and 100 μm is used.
4. The method as claimed in claim 3 , wherein a focused laser beam with a spot diameter of between 20 μm and 40 μm is used.
5. The method as claimed in claim 1 , wherein additives which absorb laser beams with a wavelength of 532 nm are admixed with the organic material.
6. The method as claimed in claim 5 , wherein at least one of an inorganic pigment, an organic pigment, at least one polymer-soluble dye and at least one fibrous filler is used as the additive.
7. The method as claimed in claim 6 , wherein at least one of an inorganic red pigment and one organic red pigment and one polymer-soluble red dye is used as the additive.
8. The method as claimed in claim 6 , wherein between 0.1% by weight and 5.0% by weight of pigments are admixed with the organic material.
9. The method as claimed in claim 6 , wherein between 1% by weight and 2% by weight of pigments are admixed with the organic material.
10. The method as claimed in claim 5 , wherein the organic material has, as a result of the admixing of the additives, a degree of absorption of at least 50% for the wavelength 532 nm of the laser radiation.
11. The method as claimed in claim 5 , wherein the organic material has, as a result of the admixing of the additives, a degree of absorption of at least 60% for the wavelength 532 nm of the laser radiation.
12. The method as claimed in claim 5 , wherein the organic material has, as a result of the admixing of the additives, a degree of absorption of at least 80% for the wavelength 532 nm of the laser radiation.
13. A device for the laser drilling of organic materials, comprising:
a frequency-doubled Nd-vanadate laser with the following laser parameters,
pulse width
<40
ns,
pulse frequency
≧20
kHz, and
wavelength
=532
nm.
.
14. The method as claimed in claim 2 , wherein a focused laser beam with a spot diameter of between 10 μm and 100 μm is used.
15. The method as claimed in claim 14 , wherein a focused laser beam with a spot diameter of between 20 μm and 40 μm is used.
16. The method as claimed in claim 7 , wherein between 0.1% by weight and 5.0% by weight of pigments are admixed with the organic material.
17. The method as claimed in claim 7 , wherein between 1% by weight and 2% by weight of pigments are admixed with the organic material.
18. The method as claimed in claim 6 , wherein the organic material has, as a result of the admixing of the additives, a degree of absorption of at least 50% for the wavelength 532 nm of the laser radiation.
19. The method as claimed in claim 7 , wherein the organic material has, as a result of the admixing of the additives, a degree of absorption of at least 50% for the wavelength 532 nm of the laser radiation.
20. The method as claimed in claim 8 , wherein the organic material has, as a result of the admixing of the additives, a degree of absorption of at least 50% for the wavelength 532 nm of the laser radiation.
21. The method as claimed in claim 9 , wherein the organic material has, as a result of the admixing of the additives, a degree of absorption of at least 50% for the wavelength 532 nm of the laser radiation.
22. The method as claimed in claim 6 , wherein the organic material has, as a result of the admixing of the additives, a degree of absorption of at least 60% for the wavelength 532 nm of the laser radiation.
23. The method as claimed in claim 7 , wherein the organic material has, as a result of the admixing of the additives, a degree of absorption of at least 60% for the wavelength 532 mm of the laser radiation.
24. The method as claimed in claim 8 , wherein the organic material has, as a result of the admixing of the additives, a degree of absorption of at least 60% for the wavelength 532 nm of the laser radiation.
25. The method as claimed in claim 9 , wherein the organic material has, as a result of the admixing of the additives, a degree of absorption of at least 60% for the wavelength 532 nm of the laser radiation.
26. The method as claimed in claim 6 , wherein the organic material has, as a result of the admixing of the additives, a degree of absorption of at least 80% for the wavelength 532 nm of the laser radiation.
27. The method as claimed in claim 7 , wherein the organic material has, as a result of the admixing of the additives, a degree of absorption of at least 80% for the wavelength 532 nm of the laser radiation.
28. The method as claimed in claim 8 , wherein the organic material has, as a result of the admixing of the additives, a degree of absorption of at least 80% for the wavelength 532 nm of the laser radiation.
29. The method as claimed in claim 9 , wherein the organic material has, as a result of the admixing of the additives, a degree of absorption of at least 80% for the wavelength 532 nm of the laser radiation.
30. A method for laser drilling of metallic materials, comprising:
using a frequency doubled Nd-vanadate laser for the laser drilling, wherein the laser includes the following laser parameters:
pulse width < 40 ns,
pulse frequency ≧ 30 kHz, and
wavelength = 532 nm.
31. The method as claimed in claim 30 , wherein a laser pulse width of less than 30 ns is used.
32. The method as claimed in claim 30 , wherein a focused laser beam with a spot diameter of between 10 μm and 100 μm is used.
33. The method as claimed in claim 32 , wherein a focused laser beam with a spot diameter with 20 μm and 40 μm is used.
34. A device for the laser drilling of metallic materials comprising:
a frequency doubled Nd-vanadate laser with the following laser parameters:
pulse width < 40 ns.
pulse frequency ≧ 30 kHz, and
wavelength = 532 nm.
35. The method as claimed in claim 34 , wherein a focused laser beam with a spot diameter of between 10 μm and 100 μm is used.
36. The method as claimed in claim 35 , wherein a focused laser beam with a spot diameter with 20 μm and 40 μm is used.