IP Library Assignment 017616/0737
Patent Assignment
Reel/Frame 017616/0737

Assignment of Assignor's Interest

Recorded: 2006-02-22 Pages: 2
Assignors
REDER, STEVEN
Executed: 2003-06-04
BERMAN, MICHAEL
Executed: 2003-06-04
Assignee
LSI LOGIC CORPORATION
1551 MCCARTHY BOULEVARD, MILPITAS, CALIFORNIA, 95035
Covered Property (1)
Process method for achieving uniform stress free electro-polishing across a copper plated wafer
Application: 11/359,734 →
Publication: US 2006/0137993
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Feb 19, 2008
From: LSI SUBSIDIARY CORP.
To: LSI CORPORATION
Reel/Frame 020548/0977 →