IP Library › Assignment 017627/0028
Patent Assignment
Reel/Frame 017627/0028

Assignment of Assignor's Interest

Recorded: 2006-05-17 Pages: 5
Assignors
LIN, MOU-SHIUNG
Executed: 2006-05-12
LO, HSIN-JUNG
Executed: 2006-05-12
CHOU, CHIU-MING
Executed: 2006-05-12
CHOU, CHIEN-KANG
Executed: 2006-05-12
CHEN, KE-HUNG
Executed: 2006-05-12
Assignee
MEGICA CORPORATION
ROOM 301/ 302, NO.47, PARK 2ND RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, TAIWAN
Covered Property (1)
Bonding Pad on Ic Substrate and Method for Making the Same
Patent: 8,148,822 →
Application: 11/383,762 →
Publication: US 2007/0023919
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →