Bonding pad on IC substrate and method for making the same
View Patent ↗A bonding pad structure is fabricated on an integrated circuit (IC) substrate having at least a contact layer on its top surface. A passivation layer covers the top surface of the IC substrate and the contact layer. The passivation layer has an opening exposing a portion of the contact layer. An electrically conductive adhesion/barrier layer directly is bonded to the contact layer. The electrically conductive adhesion/barrier layer extends to a top surface of the passivation layer. A bonding metal layer is stacked on the electrically conductive adhesion/barrier layer.
1. A metallization structure of a semiconductor device comprising a transistor, comprising:
a copper contact pad having a contact point at a bottom of an opening in an insulating layer of said semiconductor device, wherein said insulating layer comprises a nitride layer;
a metal layer under said copper contact pad and at a sidewall of said copper contact pad;
an aluminum-containing layer over said copper contact pad and vertically over said contact point;
a first titanium-containing layer between said aluminum-containing layer and said copper contact pad and vertically over said contact point;
a second titanium-containing layer on said aluminum-containing layer and vertically over said contact point; and
a gold layer on said second titanium-containing layer and vertically over said contact point, wherein said gold layer has a top surface having no dielectric layer provided thereon and is configured for a chip-on-film (COF) bonding application.
2. The metallization structure of claim 1 , wherein said gold layer comprises electroplated gold.
3. The metallization structure of claim 1 , wherein said second titanium-containing layer comprises a titanium-tungsten alloy.
4. The metallization structure of claim 1 , wherein said semiconductor device further comprises a memory device.
5. The metallization structure of claim 1 , wherein said insulating layer further comprises an oxide layer.
6. The metallization structure of claim 1 , wherein said nitride layer comprises silicon nitride.
7. The metallization structure of claim 1 , wherein said nitride layer comprises silicon oxynitride.
8. The metallization structure of claim 1 , wherein said opening has a dimension between 0.5 and 15 μm.
9. A metallization structure of a semiconductor device comprising a transistor, comprising:
a copper contact pad having a contact point at a bottom of an opening in an insulating layer of said semiconductor device, wherein said insulating layer comprises a nitride layer;
a metal layer under said copper contact pad and at a sidewall of said copper contact pad;
an aluminum-containing layer over said copper contact pad and vertically over said contact point;
a tantalum-containing layer between said aluminum-containing layer and said copper contact pad and vertically over said contact point;
a titanium-containing layer on said aluminum-containing layer and vertically over said contact point; and
a gold layer on said titanium-containing layer and vertically over said contact point, wherein said gold layer has a top surface having no dielectric layer provided thereon and is configured for a chip-on-film (COF) bonding application.
10. The metallization structure of claim 9 , wherein said gold layer comprises electroplated gold.
11. The metallization structure of claim 9 , wherein said titanium-containing layer comprises a titanium-tungsten alloy.
12. The metallization structure of claim 9 , wherein said semiconductor device further comprises a memory device.
13. The metallization structure of claim 9 , wherein said insulating layer further comprises an oxide layer.
14. The metallization structure of claim 9 , wherein said nitride layer comprises silicon nitride.
15. The metallization structure of claim 9 , wherein said nitride layer comprises silicon oxynitride.
16. The metallization structure of claim 9 , wherein said opening has a dimension between 0.5 and 15 μm.
17. A metallization structure of a semiconductor device comprising a transistor, comprising:
a copper contact pad having a contact point at a bottom of an opening in an insulating layer of said semiconductor device, wherein said insulating layer comprises a nitride layer;
a metal layer under said copper contact pad and at a sidewall of said copper contact pad;
an aluminum-containing layer over said copper contact pad and vertically over said contact point;
a first titanium-containing layer between said aluminum-containing layer and said copper contact pad and vertically over said contact point;
a second titanium-containing layer on said aluminum-containing layer and vertically over said contact point; and
a gold layer on said second titanium-containing layer and vertically over said contact point, wherein said gold layer has a top surface having no dielectric layer provided theron, and said gold layer is configured for a chip-on-glass (COG) bonding application.
18. The metallization structure of claim 17 , wherein said gold layer comprises electroplated gold.
19. The metallization structure of claim 17 , wherein said second titanium-containing layer comprises a titanium-tungsten alloy.
20. The metallization structure of claim 17 , wherein said semiconductor device further comprises a memory device.
21. The metallization structure of claim 17 , wherein said insulating layer further comprises an oxide layer.
22. The metallization structure of claim 17 , wherein said nitride layer comprises silicon nitride.
23. The metallization structure of claim 17 , wherein said nitride layer comprises silicon oxynitride.
24. The metallization structure of claim 17 , wherein said opening has a dimension between 0.5 and 15 μm.
25. A metallization structure of a semiconductor device comprising a transistor, comprising:
a copper contact pad having a contact point at a bottom of an opening in an insulating layer of said semiconductor device, wherein said insulating layer comprises a nitride layer;
a metal layer under said copper contact pad and at a sidewall of said copper contact pad;
an aluminum-containing layer over said copper contact pad and vertically over said contact point;
a tantalum-containing layer between said aluminum-containing layer and said copper contact pad and vertically over said contact point;
a titanium-containing layer on said aluminum-containing layer and vertically over said contact point; and
a gold layer on said titanium-containing layer and vertically over said contact point, wherein said gold layer has a top surface having no dielectric layer provided theron, and said gold layer is configured for a chip-on-glass (COG) bonding application.
26. The metallization structure of claim 25 , wherein said gold layer comprises electroplated gold.
27. The metallization structure of claim 25 , wherein said titanium-containing layer comprises a titanium-tungsten alloy.
28. The metallization structure of claim 25 , wherein said semiconductor device further comprises a memory device.
29. The metallization structure of claim 25 , wherein said insulating layer further comprises an oxide layer.
30. The metallization structure of claim 25 , wherein said nitride layer comprises silicon nitride.
31. The metallization structure of claim 25 , wherein said nitride layer comprises silicon oxynitride.
32. The metallization structure of claim 25 , wherein said opening has a dimension between 0.5 and 15 μm.