Patent Assignment
Reel/Frame 017628/0574
Correction for Assignee of Assignment at Reel 015625 / Frame 0501
Recorded: 2006-02-17
Pages: 3
Assignor
NAKAHATA, SEIJI
Executed: 2004-07-13
Assignee
SUMITOMO ELECTRIC INDUSTRIES, LTD.
5-33, KITAHAMA 4-CHOME, CHUO-KU, OSAKA-SHI, OSAKA, JAPAN
Covered Property
(1)
Method of Recovering and Reproducing Substrates and Method of Producing Semiconductor Wafers
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.