Patent Assignment
Reel/Frame 017629/0256
Assignment of Assignor's Interest
Recorded: 2006-02-28
Pages: 4
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Fabricating Trench Isolation Structures Having Varying Depth