Patent Assignment
Reel/Frame 017650/0638
Assignment of Assignor's Interest
Recorded: 2006-03-08
Pages: 3
Assignors
YAMAMOTO, KENICHI
Executed: 2006-03-01
MORITOKI, MASASHIGE
Executed: 2006-03-01
SHIMANE, TAKASHI
Executed: 2006-03-01
SAITO, KAZUMI
Executed: 2006-03-01
TOMIMORI, HIROAKI
Executed: 2006-03-01
ITOU, TAKAMASA
Executed: 2006-03-01
USHIJIMA, KOUSEI
Executed: 2006-03-01
TATEYAMA, KATSURO
Executed: 2006-03-01
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Method for Manufacturing Semiconductor Device to Form a via Hole
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.