Assignment of Assignor's Interest

Recorded: 2006-05-24 Pages: 13

Assignors

LUR, WATER

Executed: 2006-04-10

WANG, KUANG-CHIH

Executed: 2006-04-11

LEE, DAVID

Executed: 2006-04-12

YANG, MING-SHENG

Executed: 2006-04-17

Assignee

SCIENCE-BASED INDUSTRIAL PARK, NO., 3 LI-HSIN ROAD II, HSIN-CHU, R.O.C., TAIWAN

Covered Properties (4)

Air Gap Structure and Formation Method for Reducing Undesired Capacitive Coupling Between Interconnects in an Integrated Circuit Device

Patent: 6,917,109 →

Application: 10/295,062 →

Publication: US 2004/0097013

Air Gap for Tungsten/Aluminum Plug Applications

Patent: 7,138,329 →

Application: 10/295,080 →

Publication: US 2004/0097065

Air Gap for Dual Damascene Applications

Patent: 7,449,407 →

Application: 10/295,719 →

Publication: US 2004/0094821

Air Gap Formation Method for Reducing Undesired Capacitive Coupling Between Interconnects in an Integrated Circuit Device

Patent: 7,253,095 →

Application: 11/179,840 →

Publication: US 2005/0263896