Patent Assignment
Reel/Frame 017683/0768
Assignment of Assignor's Interest
Recorded: 2006-03-14
Pages: 2
Assignor
ARAKAWA, YOSHIKAZU
Executed: 2006-02-28
Assignee
OKI ELECTRIC INDUSTRY CO., LTD.
7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor device including protection circuit in silicon layer of SOI substrate
Application:
11/374,172 →
Publication:
US 2006/0226485
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.