Assignment of Assignor's Interest

Recorded: 2006-05-26 Received: 2006-05-26 Pages: 5

Assignors

KARNEZOS, MARCOS

Executed: 2006-05-17

CARSON, FLYNN

Executed: 2006-05-22

Assignee

STATS CHIPPAC LTD.

10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, SGX, 569059, SINGAPORE

Covered Properties (2)

Semiconductor Package Including Second Substrate and Having Exposed Substrate Surfaces on Upper and Lower Sides

Application: 11/394,635 →

Stacked Semiconductor Package System

Application: 60/594,711 →