Semiconductor package including second substrate and having exposed substrate surfaces on upper and lower sides
View Patent ↗A semiconductor package subassembly includes a die affixed to, and electrically interconnected with, a die attach side of a first package substrate, and a second substrate having a first side and a second (“land”) side, mounted over the first package with the first side of the second substrate facing the die attach side of the first package substrate, and supported by a spacer or a spacer assembly. Z-interconnection of the package and the substrate is by wire bonds connecting the first and second substrates. The assembly is encapsulated in such a way that both the land side of the second substrate (one side of the assembly) and a portion of the land side of the first package substrate (on the opposite side of the assembly) are exposed, so that second level interconnection and interconnection with additional components may be made.
1. A semiconductor package assembly, comprising at least one die mounted upon and electrically connected to, a die attach side of a first package assembly substrate, and comprising a second substrate mounted over the first package die, the side of the first package substrate opposite the die attach side being a land side of the substrate, the second substrate having a first side facing the die attach side of the first package substrate, and a second side, being the land side, facing away from the die attach side of the first package substrate, so that the land sides of the substrates face away from one another, wherein z-interconnection between the first package substrate and the second substrate is by wire bonds between wire bond sites in a marginal area on the land side of the first package substrate and peripherally located wire bond sites in a marginal area on the first side of the second substrate and connecting the first package assembly substrate and the second substrate, and wherein the package is encapsulated so that both at least a portion of the second substrate at one side of the package and at least a portion of the first package substrate at an opposite side of the assembly are exposed.
2. The assembly of claim 1 wherein the second substrate is larger than the first package substrate.
3. The assembly of claim 2 wherein the assembly encapsulation covers an area of the first side of the second substrate not contacted by a spacer or spacer structure, and encloses the z-interconnection wire bonds and wire loops, the edges of the first package, and the marginal area on the land side of the first package, so that both the land side of the second substrate and the area of the land side of the first substrate located within the marginal area, are left exposed.
4. The assembly of claim 3 wherein the assembly encapsulation covers an area of the first side of the second substrate not contacted by a spacer or spacer structure, and encloses the z-interconnection wire bonds and wire loops, the edges of the second package, and the marginal area on the land side of the second package, so that both the land side of the first substrate, and the area of the land side of the second substrate located within the marginal area, are left exposed.
5. The assembly of claim 1 wherein the first substrate is larger than the second package substrate.
6. The assembly of claim 1 wherein the first package assembly die is electrically connected with the first package substrate by wire bonds.
7. The assembly of claim 6 wherein the second substrate is supported over the first package die by a spacer, providing sufficient space between the first side of the substrate and the top of the die to accommodate a wire loop height.
8. The assembly of claim 6 wherein the second substrate is supported over the first package die by a spacer assembly, providing sufficient space between the first side of the substrate and the top of the die to accommodate a wire loop height.
9. The assembly of claim 6 wherein the second substrate is supported over the first package die by a spacer mounted upon the first package die.
10. The assembly of claim 6 wherein the second substrate is supported over the first package die by a spacer mounted upon the first package substrate.
11. The assembly of claim 1 wherein z-interconnection between the first package substrate and the second substrate is by wire bonds between wire bond sites in the marginal area on the land side of the second package substrate and peripherally located wire bond sites in a marginal area on the first side of the first substrate.
12. The assembly of claim 1 wherein the first package die and the first package substrate, together with the electrical interconnection of the die with the substrate, constitute a package subassembly.
13. The assembly of claim 12 wherein the first package comprises a ball grid array substrate, and wherein second level interconnection of the package to underlying circuitry is made by interconnection at the exposed part of land side of the first package substrate.
14. The assembly of claim 12 wherein the first package comprises a ball grid array substrate, and wherein second level interconnection of the package to underlying circuitry is made by interconnection at the exposed land side of the second substrate.
15. The assembly of claim 12 wherein the first package assembly substrate is larger than the second substrate, and second level interconnection of the package to underlying circuitry is made by solder ball interconnection at the land side of the first assembly substrate.