Patent Assignment
Reel/Frame 072788/0917
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded: 2025-09-03
Received: 2025-09-03
Pages: 48
Assignor
STATS CHIPPAC PTE. LTD.
Executed: 2025-07-10
Assignee
STATS CHIPPAC MANAGEMENT PTE. LTD.
509 YISHUN INDUSTRIAL PARK A, SINGAPORE, SGX, 768735, SINGAPORE
Covered Applications
(100)
Semiconductor Device with Partial EMI Shielding Removal Using Laser Ablation
App. No. 18/429,080
→
Semiconductor Device and Method of Forming Semiconductor Package with RF Antenna Interposer Having High Dielectric Encapsulation
App. No. 18/390,051
→
Semiconductor Device and Method of Forming a Slot in EMI Shielding with Improved Removal Depth
App. No. 18/359,688
→
Semiconductor Device and Method of Integrating RF Antenna Interposer with Semiconductor Package
App. No. 18/344,366
→
Semiconductor Device and Method of Forming Hybrid TIM Layers
App. No. 18/344,182
→
Semiconductor Device and Method of Forming Discrete Antenna Modules
App. No. 18/343,606
→
Semiconductor Device and Method of Controlling Warpage During LAB
App. No. 18/315,991
→
Method and Device for Reducing Metal Burrs When Sawing Semiconductor Packages
App. No. 18/309,951
→
Thermally Enhanced FCBGA Package
App. No. 18/305,913
→
Selective EMI Shielding Using Preformed Mask
App. No. 18/303,308
→
Selective EMI Shielding Using Preformed Mask with Fang Design
App. No. 18/174,790
→
Laser-Based Redistribution and Multi-Stacked Packages
App. No. 18/161,693
→
Molded Laser Package with Electromagnetic Interference Shield and Method of Making
App. No. 18/155,878
→
Semiconductor Device and Method of Forming Electrical Circuit Pattern Within Encapsulant of SIP Module
App. No. 18/154,993
→
Semiconductor Device and Method of Compartment Shielding Using Bond Wires
App. No. 17/819,271
→
Semiconductor Device with Partial EMI Shielding Removal Using Laser Ablation
App. No. 17/817,461
→
Cooling Device and Process for Cooling Double-Sided SiP Devices During Sputtering
App. No. 17/814,796
→
Mask Design for Improved Attach Position
App. No. 17/806,924
→
Semiconductor Device and Method for Advanced Thermal Dissipation
App. No. 17/805,951
→
EMI Shielding for Flip Chip Package with Exposed Die Backside
App. No. 17/662,977
→
EMI Shielding for Flip Chip Package with Exposed Die Backside
App. No. 17/660,093
→
Semiconductor Device and Method Using an EMI-Absorbing Metal Bar
App. No. 17/658,240
→
Semiconductor Device and Method Using Tape Attachment
App. No. 17/649,005
→
Semiconductor Device with Compartment Shield Formed from Metal Bars and Manufacturing Method Thereof
App. No. 17/648,365
→
Method and Device for Reducing Metal Burrs When Sawing Semiconductor Packages
App. No. 17/645,257
→
Semiconductor Manufacturing Equipment and Method of Providing Support Base with Filling Material Disposed into Openings in Semiconductor Wafer for Support
App. No. 17/457,155
→
Antenna-in-Package Devices and Methods of Making
App. No. 17/452,855
→
Semiconductor Device and Method of Forming Embedded Die Substrate, and System-in-Package Modules with the Same
App. No. 17/452,824
→
Semiconductor Device and Method of Making a Photonic Semiconductor Package
App. No. 17/452,489
→
Package with Compartmentalized Lid for Heat Spreader and EMI Shield
App. No. 17/451,036
→
Package with Windowed Heat Spreader
App. No. 17/450,146
→
Semiconductor Device and Method of Forming Semiconductor Package with RF Antenna Interposer Having High Dielectric Encapsulation
App. No. 17/447,336
→
Double-Sided Partial Molded SIP Module
App. No. 17/447,029
→
Semiconductor Device and Method of Controlling Warpage During LAB
App. No. 17/447,001
→
Compartment Shielding With Metal Frame and Cap
App. No. 17/447,041
→
Semiconductor Device and Method of Integrating RF Antenna Interposer with Semiconductor Package
App. No. 17/445,908
→
Semiconductor Device and Method of Stacking Devices Using Support Frame
App. No. 17/444,853
→
Thermally Enhanced FCBGA Package
App. No. 17/304,659
→
Semiconductor Device and Method of Forming Hybrid TIM Layers
App. No. 17/349,135
→
Semiconductor Device and Method of Forming Vertical Interconnect Structure for POP Module
App. No. 17/347,065
→
Region-of-Interest Positioning for Laser-Assisted Bonding
App. No. 17/342,935
→
PSPI-based Patterning Method for RDL
App. No. 17/343,402
→
Semiconductor Manufacturing Device to Securely Hold Semiconductor Panels for Transport and Manufacturing Processes
App. No. 17/339,210
→
Semiconductor Device and Method of Coating a Semiconductor Wafer with High Viscosity Liquid Photoresist Using N2 Purge
App. No. 17/319,785
→
Laser-Based Redistribution and Multi-Stacked Packages
App. No. 17/314,916
→
Semiconductor Device and Method of Forming a Slot in EMI Shielding with Improved Removal Depth
App. No. 17/308,410
→
Semiconductor Device and Method of Forming a Slot in EMI Shielding Layer Using a Plurality of Slot Lines to Guide a Laser
App. No. 17/307,437
→
Semiconductor Device and Method of Embedding Circuit Pattern in Encapsulant for SIP Module
App. No. 17/307,727
→
Semiconductor Device and Method of Forming Electrical Circuit Pattern Within Encapsulant of SIP Module
App. No. 17/307,795
→
Shielded Semiconductor Packages with Open Terminals and Methods of Making Via Two-Step Process
App. No. 17/205,779
→
Molded Laser Package with Electromagnetic Interference Shield and Method of Making
App. No. 17/163,776
→
Shielded Semiconductor Package with Open Terminal and Methods of Making
App. No. 17/136,197
→
Mask Design for Improved Attach Position
App. No. 17/127,079
→
Selective EMI Shielding Using Preformed Mask with Fang Design
App. No. 17/126,621
→
Selective EMI Shielding Using Preformed Mask
App. No. 16/950,295
→
Semiconductor Device and Method of Forming Discrete Antenna Modules
App. No. 17/092,449
→
Die-Beam Alignment for Laser-Assisted Bonding
App. No. 17/068,233
→
EMI Shielding for Flip Chip Package with Exposed Die Backside
App. No. 17/068,482
→
Semiconductor Device and Method of Providing High Density Component Spacing
App. No. 17/032,576
→
Cooling Device and Process for Cooling Double-Sided SiP Devices During Sputtering
App. No. 17/032,437
→
Semiconductor Device and Method of Compartment Shielding Using Bond Wires
App. No. 17/032,005
→
Semiconductor Device and Method of Forming SIP Module Over Film Layer
App. No. 17/010,221
→
EMI Shielding for Flip Chip Package with Exposed Die Backside
App. No. 17/008,997
→
System-in-Package with Double-Sided Molding
App. No. 17/008,918
→
Semiconductor Device with Partial EMI Shielding Removal Using Laser Ablation
App. No. 16/991,370
→
Semiconductor Device and Method of Forming a 3D Interposer System-in-Package Module
App. No. 16/990,887
→
Semiconductor Device and Method of Forming an Integrated SIP Module with Embedded Inductor or Package
App. No. 16/880,173
→
System-in-Package with Double-Sided Molding
App. No. 16/826,169
→
SEMICONDUCTOR DEVICE AND METHOD OF FORMING A 3D INTEGRATED SYSTEM-IN-PACKAGE MODULE
App. No. 16/821,202
→
SEMICONDUCTOR DEVICE AND METHOD OF FORMING PROTRUSION E-BAR FOR 3D SIP
App. No. 16/821,093
→
Semiconductor Device and Method of Forming Embedded Die Substrate, and System-in-Package Modules with the Same
App. No. 16/570,165
→
Semiconductor Device and Method of Forming SIP with Electrical Component Terminals Extending Out from Encapsulant
App. No. 16/531,593
→
EMI SHIELDING FOR FLIP CHIP PACKAGE WITH EXPOSED DIE BACKSIDE
App. No. 16/529,486
→
Semiconductor Device and Method of Forming Substrate Including Embedded Component with Symmetrical Structure
App. No. 16/267,142
→
Semiconductor Device with Partial EMI Shielding Removal Using Laser Ablation
App. No. 16/234,156
→
Shielded Semiconductor Packages with Open Terminals and Methods of Making Via Two-Step Process
App. No. 16/234,233
→
Shielded Semiconductor Package with Open Terminal and Methods of Making
App. No. 16/220,934
→
Molded Laser Package with Electromagnetic Interference Shield and Method of Making
App. No. 16/193,691
→
Method and Device for Reducing Metal Burrs When Sawing Semiconductor Packages
App. No. 16/181,619
→
Semiconductor Device with Partial EMI Shielding and Method of Making the Same
App. No. 16/116,485
→
Semiconductor Device and Method of Forming Protrusion E-Bar for 3D SIP
App. No. 16/027,731
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MANUFACTURE THEREOF
App. No. 16/005,348
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MANUFACTURE THEREOF
App. No. 16/005,387
→
Semiconductor Device and Method of Forming a 3D Interposer System-in-Package Module
App. No. 15/976,455
→
Semiconductor Device and Method of Forming a 3D Interposer System-In-Package Module
App. No. 15/830,644
→
SEMICONDUCTOR DEVICE AND METHOD OF FORMING AN INTEGRATED SIP MODULE WITH EMBEDDED INDUCTOR OR PACKAGE
App. No. 15/807,833
→
Semiconductor Device and Method of Forming Substrate Including Embedded Component with Symmetrical Structure
App. No. 15/797,107
→
Semiconductor Device and Method of Forming Embedded Die Substrate, and System-in-Package Modules with the Same
App. No. 15/706,584
→
Semiconductor Device and Method of Forming a 3D Integrated System-in-Package Module
App. No. 15/697,298
→
Semiconductor Device and Method of Forming SIP with Electrical Component Terminals Extending Out from Encapsulant
App. No. 15/686,584
→
Semiconductor Device and Method of Forming Ultra Thin Multi-Die Face-to-Face WLCSP
App. No. 15/649,491
→
Dummy Conductive Structures for EMI Shielding
App. No. 15/485,085
→
Method of Forming SIP Module Over Film Layer
App. No. 15/459,997
→
SYSTEM -IN-PACKAGE WITH DOUBLE-SIDED MOLDING
App. No. 15/458,649
→
Semiconductor Device and Method of Forming Magnetic Field Shielding with Ferromagnetic Material
App. No. 15/456,873
→
Semiconductor Device and Method of Forming Partition Fence and Shielding Layer Around Semiconductor Components
App. No. 15/456,972
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EMBEDDED PAD ON LAYERED SUBSTRATE AND METHOD OF MANUFACTURE THEREOF
App. No. 15/433,866
→
Methods of Forming Conductive and Insulating Layers
App. No. 15/202,349
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH MOLDED LASER VIA INTERPOSER AND METHOD OF MANUFACTURE THEREOF
App. No. 15/201,575
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MANUFACTURE THEREOF
App. No. 15/091,049
→