Semiconductor device and method for advanced thermal dissipation
A semiconductor device has a substrate and a semiconductor die disposed over the substrate. A tape is disposed over the semiconductor die. An encapsulant is deposited over the substrate, semiconductor die, and tape. The tape is removed to leave a cavity in the encapsulant over the semiconductor die. A shielding layer is formed over the encapsulant and semiconductor die. A heat spreader is disposed over the shielding layer. The heat spreader includes a protrusion extending into the cavity of the encapsulant.
1. A method of making a semiconductor device, comprising:
providing a substrate;
disposing a semiconductor die over the substrate;
disposing a tape over the semiconductor die;
depositing an encapsulant over the substrate, semiconductor die, and tape;
removing the tape to leave a cavity in the encapsulant over the semiconductor die;
forming a shielding layer over the encapsulant and semiconductor die; and
disposing a heat spreader over the shielding layer, wherein the heat spreader includes a protrusion extending into the cavity of the encapsulant.
2. The method of claim 1 , further including:
depositing a thermal interface material into the cavity over the shielding layer; and
disposing the heat spreader with the protrusion contacting the thermal interface material.
3. The method of claim 1 , further including disposing an antenna over the substrate opposite the semiconductor die.
4. The method of claim 3 , further including depositing a second encapsulant over the antenna.
5. The method of claim 1 , further including disposing a board-to-board connector over the substrate.
6. The method of claim 1 , further including:
providing the heat spreader as a flat plate; and
forming the protrusion by pressing the heat spreader into the cavity.
7. A method of making a semiconductor device, comprising:
providing a semiconductor die;
depositing an encapsulant over the semiconductor die with a cavity formed in the encapsulant over the semiconductor die;
forming a shielding layer over the encapsulant and semiconductor die;
disposing a thermal interface material into the cavity over the shielding layer; and
disposing a heat spreader over the shielding layer, wherein the thermal interface material extends from the shielding layer to the heat spreader.
8. The method of claim 7 , wherein the heat spreader includes a protrusion extending into the cavity of the encapsulant.
9. The method of claim 7 , further including disposing the semiconductor die over an antenna substrate.
10. The method of claim 9 , further including disposing a board-to-board connector over the antenna substrate adjacent to the semiconductor die.
11. The method of claim 7 , further including forming the cavity in the encapsulant by:
disposing a tape over the semiconductor die;
depositing the encapsulant over the tape and semiconductor die; and
removing the tape after depositing the encapsulant.
12. The method of claim 7 , further including pressing the heat spreader into the cavity.
13. A method of making a semiconductor device, comprising:
providing a substrate;
disposing a semiconductor die over the substrate;
disposing a tape over the semiconductor die;
depositing an encapsulant over the substrate, semiconductor die, and tape;
removing the tape to leave a cavity in the encapsulant over the semiconductor die; and
disposing a heat spreader over the semiconductor die, wherein the heat spreader includes a protrusion extending into the cavity of the encapsulant.
14. The method of claim 13 , further including:
depositing a thermal interface material into the cavity; and
disposing the heat spreader with the protrusion contacting the thermal interface material.
15. The method of claim 13 , further including disposing an antenna over the substrate opposite the semiconductor die.
16. The method of claim 15 , further including depositing a second encapsulant over the antenna.
17. The method of claim 13 , further including disposing a board-to-board connector over the substrate.
18. The method of claim 13 , further including:
providing the heat spreader as a flat plate; and
forming the protrusion by pressing the heat spreader into the cavity.
19. A method of making a semiconductor device, comprising:
providing a semiconductor die;
disposing a tape over the semiconductor die;
depositing an encapsulant over the semiconductor die and tape;
removing the tape after depositing the encapsulant to leave a cavity formed in the encapsulant over the semiconductor die, wherein the cavity includes a footprint having substantially the same size and shape as a footprint of the semiconductor die; and
disposing a heat spreader over the encapsulant and extending into the cavity.
20. The method of claim 19 , further including pressing the heat spreader into the cavity.
21. The method of claim 19 , further including disposing a thermal interface material into the cavity.
22. The method of claim 19 , further including disposing the semiconductor die over an antenna substrate.
23. The method of claim 22 , further including disposing a board-to-board connector over the antenna substrate adjacent to the semiconductor die.