Mask design for improved attach position
A semiconductor device has a semiconductor package including a substrate with a land grid array. A component is disposed over the substrate. An encapsulant is deposited over the component. The land grid array remains outside the encapsulant. A metal mask having a fiducial marker is disposed over the land grid array. A shielding layer is formed over the semiconductor package. The metal mask is removed after forming the shielding layer.
1. A semiconductor device, comprising:
a semiconductor package including,
a substrate comprising a land grid array,
a component disposed over the substrate, and
an encapsulant deposited over the component, wherein the land grid array remains outside the encapsulant;
a carrier, wherein the semiconductor package is disposed on the carrier;
a metal mask including a fiducial marker disposed on the carrier and extending over the land grid array; and
a shielding layer formed over the semiconductor package and metal mask.
2. The semiconductor device of claim 1 , wherein the metal mask includes a pair of fiducial markers on opposite ends of the metal mask.
3. The semiconductor device of claim 2 , wherein the fiducial markers are formed on a top surface of the metal mask.
4. The semiconductor device of claim 2 , wherein the fiducial markers are formed within a cavity of the metal mask.
5. The semiconductor device of claim 1 , wherein the metal mask includes a two-dimensional barcode.
6. The semiconductor device of claim 1 , wherein a first surface of the metal mask is anodized with a second surface of the metal mask surrounding the first surface remaining devoid of anodization.
7. A semiconductor device, comprising:
a semiconductor package including a substrate and an encapsulant deposited over a first portion of the substrate;
a mask including a fiducial marker and a two-dimensional barcode disposed over a second portion of the substrate, wherein the mask extends to within a height of the substrate; and
a shielding layer formed over the encapsulant and the mask.
8. The semiconductor device of claim 7 , wherein the mask includes a pair of fiducial markers positioned symmetrically.
9. The semiconductor device of claim 7 , wherein the fiducial marker is formed on a top surface of the mask.
10. The semiconductor device of claim 7 , wherein the fiducial marker is formed in a cavity of the mask.
11. The semiconductor device of claim 7 , wherein the mask is removable.
12. The semiconductor device of claim 7 , wherein a first surface of the mask is anodized while a second surface of the mask remains free of the anodization.
13. The semiconductor device of claim 7 , further including a vision camera trained to recognize the mask.
14. A semiconductor device, comprising:
a semiconductor package;
a mask including a fiducial marker disposed over the semiconductor package, wherein the fiducial marker is formed on a top surface of the mask, and wherein the mask extends vertically to a bottom surface of the semiconductor package; and
a shielding layer formed over the semiconductor package and the mask.
15. The semiconductor device of claim 14 , wherein the mask includes a pair of fiducial markers positioned symmetrically.
16. The semiconductor device of claim 14 , wherein the mask is reusable.
17. The semiconductor device of claim 14 , further including a second fiducial marker formed in a cavity of the mask.
18. The semiconductor device of claim 14 , wherein the mask includes a two-dimensional barcode.
19. The semiconductor device of claim 14 , wherein a first surface of the mask is anodized.
20. The semiconductor device of claim 14 , further including a vision camera trained to recognize the mask.
21. A mask for manufacturing a semiconductor device, comprising:
a top;
a side connected to the top;
a front connected to the top and the side including a lip formed at a bottom edge of the front;
a cavity adjacent to the top, the side, and the front; and
a fiducial marker formed on the top.
22. The mask of claim 21 , wherein the mask includes a two-dimensional barcode.
23. The mask of claim 21 , further including a pair of fiducial markers positioned symmetrically on the top.
24. The mask of claim 21 , wherein a first distance from the top to a bottom of the front is less than a second distance from the top to a bottom of the side.
25. The mask of claim 21 , wherein a first surface of the top is anodized with a second surface of the top surrounding the first surface remaining devoid of anodization.