Mask design for improved attach position
A semiconductor device has a semiconductor package including a substrate with a land grid array. A component is disposed over the substrate. An encapsulant is deposited over the component. The land grid array remains outside the encapsulant. A metal mask having a fiducial marker is disposed over the land grid array. A shielding layer is formed over the semiconductor package. The metal mask is removed after forming the shielding layer.
1. A method of making a semiconductor device, comprising:
providing a semiconductor package including,
a substrate comprising a land grid array,
a component disposed over the substrate, and
an encapsulant deposited over the component, wherein the land grid array remains outside the encapsulant;
disposing a metal mask including a fiducial marker over the land grid array;
forming a shielding layer over the semiconductor package; and
removing the metal mask after forming the shielding layer.
2. The method of claim 1 , wherein the metal mask includes a pair of fiducial markers on opposite ends of the metal mask.
3. The method of claim 2 , wherein the fiducial markers are formed on a top surface of the metal mask.
4. The method of claim 2 , wherein the fiducial markers are formed within a cavity of the mask.
5. The method of claim 1 , wherein the mask includes a two-dimensional barcode.
6. The method of claim 1 , further including anodizing a first surface of the metal mask while a second surface of the metal mask surrounding the first surface remains devoid of anodization.
7. A method of making a semiconductor device, comprising:
providing a semiconductor package including a substrate and an encapsulant deposited over a first portion of the substrate;
disposing a mask including a fiducial marker and a two-dimensional barcode over a second portion of the substrate;
forming a shielding layer over the encapsulant; and
removing the mask.
8. The method of claim 7 , wherein the mask includes a pair of fiducial markers positioned symmetrically.
9. The method of claim 7 , wherein the fiducial marker is formed on a top surface of the mask.
10. The method of claim 7 , wherein the fiducial marker is formed in a cavity of the mask.
11. The method of claim 7 , further including anodizing a first surface of the mask with a tape disposed on a second surface of the mask.
12. The method of claim 7 , further including aligning the mask to the semiconductor package by training a vision camera to recognize the mask.
13. A method of making a semiconductor device, comprising:
providing a semiconductor package;
disposing a mask including a fiducial marker over the semiconductor package, wherein the fiducial marker is formed on a top surface of the mask;
forming a shielding layer over the semiconductor package; and
removing the mask.
14. The method of claim 13 , wherein the mask includes a pair of fiducial markers positioned symmetrically.
15. The method of claim 13 , further including a second fiducial marker formed in a cavity of the mask.
16. The method of claim 13 , wherein the mask includes a two-dimensional barcode.
17. The method of claim 13 , further including anodizing a first surface of the mask with a tape disposed on a second surface of the mask.
18. The method of claim 13 , further including aligning the mask to the semiconductor package by training a vision camera to recognize the mask.
19. A method of making a semiconductor device, comprising:
providing a semiconductor package;
disposing a mask including a pair of fiducial markers positioned symmetrically over the semiconductor package; and
forming a shielding layer over the semiconductor package and mask.
20. The method of claim 19 , wherein the mask includes a two-dimensional barcode.
21. The method of claim 19 , further including anodizing a first surface of the mask with a tape disposed on a second surface of the mask.
22. The method of claim 19 , further including aligning the mask to the semiconductor package by training a vision camera to recognize the mask.