Antenna-in-package devices and methods of making

1. A method of making a semiconductor device, comprising:

providing a PCB including an antenna formed on a first surface of the PCB;

providing a semiconductor package, including,

a substrate,

an encapsulant deposited over the substrate, and

a shielding layer completely covering a top surface of the encapsulant opposite the substrate and all side surfaces of the semiconductor package, wherein the shielding layer is connected to a ground node through a conductive layer of the substrate;

mounting the semiconductor package onto a second surface of the PCB opposite the first surface; and

disposing an epoxy molding compound (EMC) bump on the first surface of the PCB over the antenna, wherein the EMC bump is electrically insulating.

2. The method of claim 1 , wherein the EMC bump is molded onto the PCB.

3. The method of claim 1 , further including forming a second shielding layer over the PCB.

4. The method of claim 1 , further including mounting a board-to-board (B2B) connector to the PCB.

5. The method of claim 1 , wherein the semiconductor package includes a board-to-board (B2B) connector.

6. The method of claim 1 , further including disposing a conductive bump between the semiconductor package and PCB.

7. A method of making a semiconductor device, comprising:

providing an antenna PCB, wherein the antenna PCB includes a PCB and an antenna formed as part of a conductive layer directly on or in a first surface of the PCB;

disposing a semiconductor package over a second surface of the antenna PCB opposite the first surface, wherein the semiconductor package includes,

a substrate,

a first semiconductor die mounted onto a first surface of the substrate,

a first encapsulant deposited over the first surface of the substrate with the first semiconductor die embedded in the first encapsulant,

a second semiconductor die mounted onto a second surface of the substrate,

a second encapsulant deposited over the second surface of the substrate with the second semiconductor die embedded in the second encapsulant,

a solder bump extending through the first encapsulant to the antenna PCB, and

a shielding layer completely covering a top surface of the first encapsulant opposite the substrate and all side surfaces of the semiconductor package, wherein the shielding layer is connected to a ground node through a conductive layer of the substrate; and

forming a plurality of polymer bumps on the first surface of the antenna PCB, wherein the polymer bumps are electrically insulating.

8. The method of claim 7 , further including:

disposing a mask over the antenna PCB;

forming a shielding layer over the antenna PCB and mask; and

removing the mask.

9. The method of claim 7 , further including disposing a board-to-board (B2B) connector over the antenna PCB, wherein the B2B connector is coupled to the semiconductor package through the antenna PCB.

10. The method of claim 7 , wherein the semiconductor package includes a double-sided SiP module.

11. The method of claim 7 , wherein the polymer bumps include a high dielectric constant.

12. The method of claim 7 , further including disposing the solder bump between the antenna PCB and the substrate of the semiconductor package.

13. The method of claim 7 , wherein the antenna PCB is devoid of electrical components except for the antenna and a conductive path to couple the antenna to the semiconductor package.

14. The method of claim 7 , further including forming the plurality of polymer bumps directly on the antenna.

15. A semiconductor device, comprising:

a PCB including an antenna;

a semiconductor package mounted onto the PCB, wherein the semiconductor package includes,

a substrate,

a semiconductor die mounted onto a first surface of the substrate,

a first encapsulant deposited over the first surface of the substrate,

a solder bump extending through the encapsulant from the substrate to the PCB,

a second encapsulant deposited over a second surface of the substrate opposite the first surface, and

a shielding layer completely covering a top surface of the encapsulant opposite the substrate and all side surfaces of the semiconductor package, wherein the shielding layer is connected to a ground node through a conductive layer of the substrate; and

a plurality of polymer bumps formed on a surface of the antenna PCB opposite the semiconductor package, wherein the polymer bumps are electrically insulating.

16. The semiconductor device of claim 15 , further including a second shielding layer formed over the PCB.

17. The semiconductor device of claim 15 , further including a board-to-board (B2B) connector mounted to the PCB.

18. The semiconductor device of claim 15 , further including a board-to-board (B2B) connector disposed on the semiconductor package.

19. A semiconductor device, comprising:

an antenna PCB including an antenna formed as part of a conductive layer directly on or in a first surface of the antenna PCB;

a board-to-board (B2B) connector mounted onto the antenna PCB;

a semiconductor package disposed over a second surface of the antenna PCB, wherein the B2B connector is coupled to the semiconductor package through the antenna PCB;

a shielding layer completely covering a top surface and all side surfaces of the semiconductor package; and

a polymer bump formed on the first surface of the antenna PCB directly over the antenna, wherein the polymer bump is electrically insulating.

20. The semiconductor device of claim 19 , further including a shielding layer formed over the antenna PCB.

21. The semiconductor device of claim 19 , further including a shielding layer formed over the semiconductor package.

22. The semiconductor device of claim 19 , wherein the semiconductor package includes a double-sided SiP module.

23. The semiconductor device of claim 19 , wherein the polymer bump includes a high dielectric constant.