Cooling device and process for cooling double-sided SiP devices during sputtering
A semiconductor manufacturing device has a cooling pad with a plurality of movable pins. The cooling pad includes a fluid pathway and a plurality of springs disposed in the fluid pathway. Each of the plurality of springs is disposed under a respective movable pin. A substrate includes an electrical component disposed over a surface of the substrate. The substrate is disposed over the cooling pad with the electrical component oriented toward the cooling pad. A force is applied to the substrate to compress the springs. At least one of the movable pins contacts the substrate. A cooling fluid is disposed through the fluid pathway.
1. A semiconductor device, comprising:
a cooling pad including a plurality of movable pins, wherein the cooling pad includes a fluid pathway and a plurality of springs disposed in the fluid pathway with each of the plurality of springs disposed under a respective movable pin;
a substrate disposed over the cooling pad;
an electrical component mounted to the substrate between the substrate and cooling pad, wherein the springs are compressed and at least one of the movable pins contacts the substrate; and
a cooling fluid disposed in the fluid pathway.
2. The semiconductor device of claim 1 , further including a conductive layer sputtered over the substrate.
3. The semiconductor device of claim 1 , further including a heat exchanger with a portion of the cooling fluid disposed in the heat exchanger.
4. The semiconductor device of claim 1 , further including a coating formed over the plurality of movable pins.
5. The semiconductor device of claim 4 , wherein a first movable pin of the plurality of movable pins contacts a second movable pin of the plurality of movable pins.
6. The semiconductor device of claim 1 , wherein each of the plurality of movable pins includes a flange disposed in the fluid pathway.
7. A semiconductor device, comprising:
a cooling pad including a plurality of movable pins; and
a substrate including a component disposed over a surface of the substrate, wherein the substrate is disposed over the cooling pad with a first movable pin contacting the component and a second movable pin contacting the substrate.
8. The semiconductor device of claim 7 , further including:
a first spring disposed in the cooling pad under the first movable pin; and
a second spring disposed in the cooling pad under the second movable pin.
9. The semiconductor device of claim 7 , further including a cooling fluid disposed in the cooling pad.
10. The semiconductor device of claim 9 , further including a heat exchanger with a portion of the cooling fluid disposed in the cooling pad.
11. The semiconductor device of claim 7 , further including a conductive layer formed over the substrate.
12. The semiconductor device of claim 7 , further including a coating formed on top surfaces of the plurality of movable pins.
13. The semiconductor device of claim 7 , further including a coating formed on side surfaces of the plurality of movable pins.
14. A semiconductor device, comprising:
a cooling pad;
a fluid pathway formed in the cooling pad;
a cooling fluid disposed in the cooling pathway;
a plurality of pins extending from within the fluid pathway to outside the cooling pad; and
a plurality of springs with a spring of the plurality of springs disposed in the cooling pad under each of the plurality of pins.
15. The semiconductor device of claim 14 , further including a heat exchanger coupled to the cooling pad.
16. The semiconductor device of claim 14 , further including a substrate disposed over the cooling pad with a component of the substrate contacting one of the plurality of pins.
17. The semiconductor device of claim 14 , further including a coating formed on a top surface of the plurality of pins.
18. The semiconductor device of claim 14 , further including a coating formed on a side surface of the plurality of pins.
19. A semiconductor device, comprising:
a cooling pad;
a fluid pathway formed in the cooling pad;
a pin extending from within the fluid pathway to outside the cooling pad; and
a spring disposed in the cooling pad under the pin.
20. The semiconductor device of claim 19 , further including a heat exchanger coupled to the cooling pad.
21. The semiconductor device of claim 19 , further including a substrate disposed over the cooling pad with a component of the substrate contacting the pin.
22. The semiconductor device of claim 19 , further including a coating formed on a surface of the pin.
23. The semiconductor device of claim 19 , further including a plurality of pins extending from within the fluid pathway to outside the cooling pad.