Patent Assignment
Reel/Frame 060611/0136
Assignment of Assignor's Interest
Recorded: 2022-07-25
Pages: 6
Assignors
KIM, OHHAN
Executed: 2020-09-23
LEE, HUNTEAK
Executed: 2020-09-23
JUNG, SELL
Executed: 2020-09-23
LEE, HEESOO
Executed: 2020-09-23
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Cooling Device and Process for Cooling Double-Sided SiP Devices During Sputtering
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.