Semiconductor device and method of forming electrical circuit pattern within encapsulant of SIP module
A semiconductor device has an electronic component assembly with a substrate and a plurality of electrical components disposed over the substrate. A conductive post is formed over the substrate. A molding compound sheet is disposed over the electrical component assembly. A carrier including a first electrical circuit pattern is disposed over the molding compound sheet. The carrier is pressed against the molding compound sheet to dispose a first encapsulant over and around the electrical component assembly and embed the first electrical circuit pattern in the first encapsulant. A shielding layer can be formed over the electrical components assembly. The carrier is removed to expose the first electrical circuit pattern. A second encapsulant is deposited over the first encapsulant and the first electrical circuit pattern. A second electrical circuit pattern is formed over the second encapsulant. A semiconductor package is disposed over the first electrical circuit pattern.
1. A method of making a semiconductor device, comprising:
providing an electrical component assembly;
forming a conductive post in contact with the electrical component assembly;
disposing a molding compound sheet over the electrical component assembly after forming the conductive post in contact with the electrical component assembly;
disposing a carrier including a first electrical circuit pattern over the molding compound sheet; and
pressing the carrier against the molding compound sheet to dispose a first encapsulant over and around the electrical component assembly and embed the first electrical circuit pattern in the first encapsulant.
2. The method of claim 1 , further including removing the carrier to expose the first electrical circuit pattern.
3. The method of claim 2 , further including
disposing a second encapsulant over the first encapsulant and the first electrical circuit pattern; and
forming a second electrical circuit pattern over the second encapsulant.
4. The method of claim 1 , further including forming a shielding layer over the electrical component assembly.
5. The method of claim 1 , wherein providing the electronic component assembly includes:
providing a substrate; and
disposing a plurality of electrical components over the substrate.
6. The method of claim 1 , further including removing a portion of the first encapsulant to expose the conductive post.
7. A method of making a semiconductor device, comprising:
providing a substrate;
forming a conductive post in contact with the substrate;
disposing a molding compound sheet over the substrate after forming the conductive post in contact with the substrate;
disposing a carrier including a first electrical circuit pattern over the molding compound sheet; and
pressing the carrier against the molding compound sheet to dispose a first encapsulant over the substrate and embed the first electrical circuit pattern in the first encapsulant.
8. The method of claim 7 , further including disposing a plurality of electrical components over the substrate to form an electrical component assembly.
9. The method of claim 8 , further including forming a shielding layer over the electrical component assembly.
10. The method of claim 7 , further including removing the carrier to expose the first electrical circuit pattern.
11. The method of claim 10 , further including
disposing a second encapsulant over the first encapsulant and the first electrical circuit pattern; and
forming a second electrical circuit pattern over the second encapsulant.
12. The method of claim 7 , further including removing a portion of the first encapsulant to expose the conductive post.
13. The method of claim 7 , further including disposing a semiconductor package over the first electrical circuit pattern.
14. A method of making a semiconductor device, comprising:
providing an electrical component assembly;
forming a conductive post over the electrical component assembly;
disposing a molding compound sheet over the electrical component assembly after forming the conductive post over the electrical component assembly;
disposing a first electrical circuit pattern over the molding compound sheet; and
pressing the first electrical circuit pattern into the molding compound sheet to dispose a first encapsulant over and around the electrical component assembly and embed the first electrical circuit pattern in the first encapsulant.
15. The method of claim 14 , further including
disposing a second encapsulant over the first encapsulant and the first electrical circuit pattern; and
forming a second electrical circuit pattern over the second encapsulant.
16. The method of claim 14 , further including forming a shielding layer over the electrical component assembly.
17. The method of claim 14 , wherein providing the electronic component assembly includes:
providing a substrate; and
disposing a plurality of electrical components over the substrate.
18. The method of claim 14 , further including removing a portion of the first encapsulant to expose the conductive post.
19. The method of claim 14 , further including disposing a semiconductor package over the first electrical circuit pattern.
20. A method of making a semiconductor device, comprising:
providing a substrate;
forming a conductive post over the substrate;
disposing a molding compound sheet over the substrate after forming the conductive post over the substrate;
disposing a first electrical circuit pattern over the molding compound sheet; and
pressing the first electrical circuit pattern into the molding compound sheet to dispose a first encapsulant over the substrate and embed the first electrical circuit pattern in the first encapsulant.
21. The method of claim 20 , further including disposing a plurality of electrical components over the substrate to form an electrical component assembly.
22. The method of claim 21 , further including forming a shielding layer over the electrical component assembly.
23. The method of claim 20 , further including:
disposing a second encapsulant over the first encapsulant and the first electrical circuit pattern; and
forming a second electrical circuit pattern over the second encapsulant.
24. The method of claim 20 , further including removing a portion of the first encapsulant to expose the conductive post.
25. The method of claim 20 , further including disposing a semiconductor package over the first electrical circuit pattern.