Semiconductor device and method of forming a 3D interposer system-in-package module
A semiconductor device has a first substrate and a second substrate. An opening is formed through the second substrate. A first semiconductor component and second semiconductor component are disposed between the first substrate and second substrate. The second substrate is electrically coupled to the first substrate through the first semiconductor component. A first terminal of the first semiconductor component is electrically coupled to the first substrate. A second terminal of the first semiconductor component is electrically coupled to the second substrate. The second semiconductor component extends into the opening. An encapsulant is deposited over the first substrate and second substrate.
1. A method of making a semiconductor device, comprising:
providing a first substrate;
providing a second substrate;
forming an opening through the second substrate;
disposing a first semiconductor component and second semiconductor component between the first substrate and second substrate, wherein the second substrate is electrically coupled to the first substrate through the first semiconductor component and the second semiconductor component extends into the opening, and wherein the first semiconductor component supports the first substrate over the second substrate; and
depositing an encapsulant over the first substrate and second substrate.
2. The method of claim 1 , further including:
electrically coupling a first terminal of the first semiconductor component to the first substrate; and
electrically coupling a second terminal of the first semiconductor component to the second substrate.
3. The method of claim 2 , wherein the first terminal of the first semiconductor component is directly over the second terminal of the first semiconductor component.
4. The method of claim 2 , further including disposing a non-conductive material between the first terminal and the second substrate or between the second terminal and the first substrate.
5. The method of claim 1 , further including forming a shielding layer over the encapsulant.
6. A method of making a semiconductor device, comprising:
providing a first substrate;
providing a second substrate;
disposing a semiconductor component between the first substrate and second substrate, wherein the second substrate is electrically coupled to the first substrate through the semiconductor component;
disposing a non-conductive material between a first terminal of the semiconductor component and the first substrate or second substrate; and
depositing an encapsulant over the first substrate and second substrate.
7. The method of claim 6 , further including:
electrically coupling the first terminal of the semiconductor component to the first substrate; and
electrically coupling a second terminal of the semiconductor component to the second substrate.
8. The method of claim 6 , further including disposing a semiconductor die over the second substrate.
9. The method of claim 6 , wherein the first substrate and second substrate are electrically coupled to a common terminal of the semiconductor component.
10. The method of claim 6 , further including forming a shielding layer over the encapsulant, wherein the shielding layer is electrically connected to the first substrate or second substrate.
11. The method of claim 6 , further including:
forming an opening through the second substrate; and
disposing a second semiconductor component between the first substrate and second substrate with the second semiconductor component extending into the opening.
12. The method of claim 6 , further including disposing a second semiconductor component over the second substrate opposite the semiconductor component.
13. A method of making a semiconductor device, comprising:
providing a first substrate;
providing a second substrate;
forming an opening through the second substrate;
disposing a first semiconductor component between the first substrate and second substrate, wherein the second substrate is electrically coupled to the first substrate through the first semiconductor component, and wherein a first terminal of the first semiconductor component is directly over a second terminal of the first semiconductor component; and
disposing a second semiconductor component between the first substrate and second substrate with the second semiconductor component extending into the opening.
14. The method of claim 13 , further including disposing a third semiconductor component over the second substrate opposite the first semiconductor component.
15. The method of claim 14 , wherein the third semiconductor component is electrically connected to the first semiconductor component through the second substrate.
16. The method of claim 13 , further including depositing an encapsulant over the first substrate, second substrate, first semiconductor component, and second semiconductor component.
17. The method of claim 16 , further including forming a shielding layer over the encapsulant.
18. A semiconductor device, comprising:
a first substrate;
a second substrate;
a semiconductor component electrically coupled between the first substrate and second substrate with a first terminal of the semiconductor component directly over a second terminal of the semiconductor component;
an encapsulant deposited over the first substrate, second substrate, and semiconductor component; and
a shielding layer formed over the encapsulant.
19. The semiconductor device of claim 18 , wherein the semiconductor component is oriented vertically between the first substrate and second substrate.
20. The semiconductor device of claim 18 , wherein the shielding layer physically contacts the first substrate or second substrate.
21. The semiconductor device of claim 18 , further including:
an opening formed through the second substrate; and
a second semiconductor component disposed between the first substrate and second substrate with the second semiconductor component extending into the opening.