Patent Assignment
Reel/Frame 045771/0395
Assignment of Assignor's Interest
Recorded: 2018-05-10
Pages: 8
Assignors
YANG, DEOKKYUNG
Executed: 2018-05-10
KIM, OHHAN
Executed: 2018-05-10
LEE, HEESOO
Executed: 2018-05-10
LEE, HUNTEAK
Executed: 2018-05-10
YOON, INSANG
Executed: 2018-05-10
SHIM, IL KWON
Executed: 2018-05-09
Assignee
STATS CHIPPAC PTE. LTD.
10 ANG MO KIO STREET 65, TECHPOINT #04-08/09, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming a 3D Interposer System-in-Package Module
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.