Patent Assignment
Reel/Frame 017699/0701
Assignment of Assignor's Interest
Recorded: 2006-05-31
Pages: 6
Assignors
LEE, BOUNG JU
Executed: 2006-05-15
SHIN, HEON JONG
Executed: 2006-05-15
KANG, HEE SUNG
Executed: 2006-05-15
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Dual-Damascene Metal Wiring Patterns for Integrated Circuit Devices