Patent Assignment
Reel/Frame 017704/0676
Assignment of Assignor's Interest
Recorded: 2006-05-25
Pages: 3
Assignor
GASKINS, DARIUS D.
Executed: 2006-04-10
Assignee
VIA TECHNOLOGIES, INC.
8F, 535, CHUNG-CHENG ROAD, HSIN-TIEN, TAIPEI 231, TAIWAN
Covered Property
(1)
Apparatus and Method for Dynamic Configuration of Temperature Profile in an Integrated Circuit