Patent Assignment
Reel/Frame 017714/0219
Assignment of Assignor's Interest
Recorded: 2006-03-21
Pages: 4
Assignor
HEO, SUNG-SOO
Executed: 2006-03-10
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Wafer Loading Apparatus