Patent Assignment
Reel/Frame 017722/0467
Assignment of Assignor's Interest
Recorded: 2006-03-24
Pages: 3
Assignor
SASAKI, HIDEHIRO
Executed: 2006-03-09
Assignee
JSP CORPORATION
4-2, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Expanded Polypropylene Resin Beads, Method of Producing Foam Molding of Expanded Polypropylene Resin Beads and Foam Molding Obtained by the Method