Patent Assignment
Reel/Frame 017726/0354
Assignment of Assignor's Interest
Recorded: 2006-03-24
Pages: 2
Assignor
TAKAHASHI, NORIO
Executed: 2006-02-27
Assignee
OKI ELECTRIC INDUSTRY CO., LTD.
7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO 105-8460, JAPAN
Covered Property
(1)
Semiconductor Chip Package and Manufacturing Method Thereof
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.