Patent Assignment
Reel/Frame 017736/0505
Assignment of Assignor's Interest
Recorded: 2006-03-29
Pages: 2
Assignor
IKEGAMI, NAOKATSU
Executed: 2006-03-24
Assignee
OKI ELECTRIC INDUSTRY CO., LTD.
7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Method of Fabricating Semiconductor Device Including Forming a Protective Layer and Removing After Etching a Trench
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.