Assignment of Assignor's Interest

Recorded: 2006-03-31 Pages: 3

Assignor

LEE, YONG JUN

Executed: 2006-03-03

Assignee

DONGBUANAM SEMICONDUCTOR INC.

891-10, DAECHI-DONG, GANGNAM-GU, SEOUL 135-280, KOREA, REPUBLIC OF

Covered Property (1)

Method for rounding top corners of isolation trench in semiconductor device

Application: 11/318,587 →

Publication: US 2006/0160326

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.