Patent Assignment
Reel/Frame 018093/0282
Change of Name
Recorded: 2006-07-11
Pages: 10
Assignor
DONGBUANAM SEMICONDUCTOR INC.
Executed: 2006-03-24
Assignee
DONGBU ELECTRONICS CO., LTD.
891-10 DAECHI-DONG, KANGNAM-KU, SEOUL, 135-523, KOREA, REPUBLIC OF
Covered Properties
(8)
Vertical-Type Capacitor Structure
Method for rounding top corners of isolation trench in semiconductor device
Application:
11/318,587 →
Publication:
US 2006/0160326
Metallization Method of Semiconductor Device
Method of Forming Double Gate Dielectric Layers and Semiconductor Device Having the Same
Semiconductor Device Having Silicide-Blocking Layer and Fabrication Method Thereof
Metallization Method of Semiconductor Device
Method for Forming Split Gate Flash Nonvolatile Memory Devices
Method for forming resistors in semiconductor integrated circuit devices
Application:
11/320,979 →
Publication:
US 2006/0148189
Related Assignments
(17)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 28, 2005
From: KIM, JUNG JOO
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 017424/0215 →
Assignment of Assignor's Interest
Dec 28, 2005
From: CHOI, CHEE HONG
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 017432/0136 →
Assignment of Assignor's Interest
Dec 29, 2005
From: KIM, JUNG JOO
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 017430/0802 →
Assignment of Assignor's Interest
Dec 29, 2005
From: CHOI, CHEE HONG
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 017429/0795 →
Assignment of Assignor's Interest
Dec 29, 2005
From: AHN, YONG SOO
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 017424/0774 →
Assignment of Assignor's Interest
Dec 30, 2005
From: KEUM, DONG YEAL
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 017432/0084 →
Assignment of Assignor's Interest
Dec 30, 2005
From: KIM, HEONG JIN
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 017426/0455 →
Assignment of Assignor's Interest
Mar 31, 2006
From: LEE, YONG JUN
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 017742/0621 →
Assignment of Assignor's Interest
Oct 15, 2014
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 034009/0157 →
Corrective Assignment to Correct Remove Patent No. 878209 from Exhibit B Previously Recorded at Reel: 034009 Frame: 0157. Assignor(S) Hereby Confirms the Assignment.
Oct 24, 2014
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 034087/0097 →
Assignment of Assignor's Interest
Mar 1, 2017
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 041426/0597 →
Merger and Change of Name
Nov 29, 2017
From: DONGBU ELECTRONICS CO., LTD.; DONGBU HITEK CO., LTD.
To: DONGBU HITEK CO., LTD.
Reel/Frame 044533/0523 →
Change of Name
Nov 30, 2017
From: DONGBU HITEK CO., LTD.
To: DB HITEK CO., LTD
Reel/Frame 044555/0913 →
Assignment of Assignor's Interest
Jul 10, 2019
From: DB HITEK CO., LTD.
To: COLUMBA TECHNOLOGIES INC.
Reel/Frame 049709/0857 →
Assignment of Assignor's Interest
Jun 23, 2021
From: INPHI CORPORATION
To: MARVELL TECHNOLOGY CAYMAN I
Reel/Frame 056649/0823 →
Assignment of Assignor's Interest
Jun 25, 2021
From: MARVELL TECHNOLOGY CAYMAN I
To: CAVIUM INTERNATIONAL
Reel/Frame 057279/0519 →
Assignment of Assignor's Interest
Aug 27, 2021
From: CAVIUM INTERNATIONAL
To: MARVELL ASIA PTE LTD.
Reel/Frame 057336/0873 →