Metallization method of semiconductor device
View Patent ↗A method for forming a metallization contact in a semiconductor device includes (a) forming an insulating layer on a semiconductor substrate including an active device region or a lower metal wire; (b) forming a contact hole to expose a portion of the active device region or lower metal wire by etching a portion of the insulating layer; (c) depositing a first TiN layer on the insulating layer and inside the contact hole by a PVD process using a first carrier gas composition of nitrogen (N 2 ) and argon (Ar); (d) depositing a second TiN layer on the first TiN layer by a PVD process using a second carrier gas composition of nitrogen (N 2 ) and argon (Ar); and (e) forming a metal layer on the second TiN layer.
1. A method for forming a metallization contact in a semiconductor device, comprising the steps of:
forming an insulating layer over a semiconductor substrate including an active device region or a lower metal wire;
forming a contact hole to expose a portion of the active device region or lower metal wire by etching a portion of the insulating layer;
depositing a first TiN layer on the insulating layer and inside the contact hole by a PVD process using a first carrier gas composition of nitrogen (N 2 ) and argon (Ar), the first TiN layer having a first density controlled by the first carrier gas composition;
depositing a second TiN layer directly on the first TiN layer by a PVD process using a second carrier gas composition of nitrogen (N 2 ) and argon (Ar), the second TiN layer having a second density controlled by the second carrier gas composition; and
forming a metal layer on the second TiN layer, wherein the second carrier gas composition has an N 2 -to-Ar ratio different from that of the first carrier gas composition.
2. The method of claim 1 , wherein the semiconductor substrate includes an active region, the metallization contact connects the metal layer and the active region, and the first carrier gas composition has a lower ratio of N 2 -to-Ar than the second carrier gas composition.
3. The method of claim 1 , further comprising, before depositing the first TiN layer, forming a titanium layer over the insulating layer in an argon atmosphere.
4. The method of claim 1 , wherein the semiconductor substrate includes a lower metal wire, the metallization contact connects the metal layer and the lower metal wire, and the first carrier gas composition has a higher ratio of N 2 -to-Ar than the second carrier gas composition.
5. The method of claim 2 , wherein the first density is greater than the second density.
6. The method of claim 1 , wherein forming the metal layer comprises forming tungsten or aluminum.
7. The method of claim 4 , wherein the second density is greater than the first density.