Patent Assignment
Reel/Frame 017750/0553
Assignment of Assignor's Interest
Recorded: 2006-04-03
Pages: 3
Assignor
LI, YICHENG
Executed: 2006-01-03
Assignee
TOKYO ELECTRON LIMITED
3-6, AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-8481, JAPAN
Covered Property
(1)
Method and system for sealing a first assembly to a second assembly of a processing system