Patent Assignment
Reel/Frame 017764/0341
Assignment of Assignor's Interest
Recorded: 2006-06-12
Pages: 2
Assignor
JENG, PEI-REN
Executed: 2006-04-28
Assignee
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
NO. 195, SEC. 4, CHUNG-HSING RD., CHUTUNG CHEN, HSINCHU HSIEN, TAIWAN
Covered Property
(1)
Interlayer Interconnect of Three-Dimensional Memory and Method for Manufacturing the Same