Assignment of Assignor's Interest

Recorded: 2006-04-12 Pages: 3

Assignor

NISHIDA, KOJI

Executed: 2006-04-10

Assignee

NEC ELECTRONICS CORPORATION

1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA 211-8668, JAPAN

Covered Property (1)

BGA type semiconductor package featuring additional flat electrode teminals, and method for manufacturing the same

Application: 11/402,008 →

Publication: US 2006/0231935

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.