Patent Assignment
Reel/Frame 017789/0345
Assignment of Assignor's Interest
Recorded: 2006-04-17
Pages: 3
Assignors
PARK, KI-CHUL
Executed: 2006-03-22
KU, JA-HUM
Executed: 2006-03-22
CHOI, SEUNG-MAN
Executed: 2006-03-22
Assignee
SAMSUNG ELECTRONICS, CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, KYUNGKI-DO, SUWON-CITY, KOREA, REPUBLIC OF
Covered Property
(1)
Methods for Forming Damascene Wiring Structures Having Line and Plug Conductors Formed from Different Materials