Patent Assignment
Reel/Frame 017795/0538
Assignment of Assignor's Interest
Recorded: 2006-04-20
Pages: 3
Assignee
VIA TECHNOLOGIES, INC.
8F, NO. 535, CHUNG-CHENG RD., HSIN-TIEN, TAIPEI 231, R.O.C., TAIWAN
Covered Property
(1)
Electronic Apparatus and Thermal Dissipating Module Thereof