Patent Assignment
Reel/Frame 017798/0250
Assignment of Assignor's Interest
Recorded: 2006-06-15
Pages: 3
Assignor
KIM, SI-YOUN
Executed: 2006-05-24
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Forming a Semiconductor Device Having an Etch Stop Layer and Related Device