Patent Assignment
Reel/Frame 017801/0772
Assignment of Assignor's Interest
Recorded: 2006-04-24
Pages: 4
Assignors
CHEONG, SEONG-HWEE
Executed: 2006-03-28
CHOI, GIL-HEYUN
Executed: 2006-03-24
LEE, SANG-WOO
Executed: 2006-03-24
PARK, JIN-HO
Executed: 2006-03-28
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Fabricating Semiconductor Devices Including Contact Plugs Having Laterally Extending Portions