IP Library Assignment 017807/0808
Patent Assignment
Reel/Frame 017807/0808

Assignment of Assignor's Interest

Recorded: 2006-04-21 Pages: 3
Assignors
MINAMIHABA, GAKU
Executed: 2006-01-31
FUKUSHIMA, DAI
Executed: 2006-01-31
KURASHIMA, NOBUYUKI
Executed: 2006-02-03
YAMAMOTO, SUSUMU
Executed: 2006-02-08
YANO, HIROYUKI
Executed: 2006-02-06
Assignee
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO 105-8001, JAPAN
Covered Property (1)
Cmp Slurry for Metallic Film, Polishing Method and Method of Manufacturing Semiconductor Device
Patent: 7,842,191 →
Application: 11/340,494 →
Publication: US 2006/0243702
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 24, 2017
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 043709/0035 →
Change of Name and Address Jan 22, 2021
From: K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 055669/0401 →
Merger Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: K.K. PANGEA
Reel/Frame 055659/0471 →
Change of Name and Address Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 055669/0001 →