Patent Assignment
Reel/Frame 017808/0600
Assignment of Assignor's Interest
Recorded: 2006-04-21
Pages: 3
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO 381-2287, JAPAN
Covered Property
(1)
Electronic Parts Packaging Structure and Method of Manufacturing the Same